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Items where Author is "Rajaguru, Pushpa"

Items where Author is "Rajaguru, Pushpa"

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corrosion creep damage design process failure fatigue fatigue failure micro-probe microsystems model order reduction novel micro-integrated products power electronic module probabilistic optimisation reduced order models risk analysis solder interconnect subsea cable scoring system-in-package three-dimensional miniaturised products vibration viscoplastic behaviour wirebond
Number of items: 25.

corrosion

Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

creep

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

damage

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

design process

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

failure

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

fatigue

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

fatigue failure

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

micro-probe

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

microsystems

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

model order reduction

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

novel micro-integrated products

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

power electronic module

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

probabilistic optimisation

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

reduced order models

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

risk analysis

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

solder interconnect

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2019) Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE Transactions on Device and Materials Reliability, 19 (1). ISSN 1530-4388 (Print), 1558-2574 (Online) (doi:10.1109/TDMR.2019.2891949)

subsea cable scoring

Flynn, David, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

system-in-package

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Reduced order modelling for reliability optimisation of advanced micro-systems. In: EngOpt2010 2nd International Conference on Engineering Optimization. International Conference on Engineering Optimization (2). EngOpt2010, pp. 1-10.

three-dimensional miniaturised products

Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)

vibration

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

viscoplastic behaviour

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

wirebond

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226 (2023) Damage mechanics-based failure prediction of wirebond in power electronic module. IEEE Access. ISSN 2169-3536 (doi:10.1109/ACCESS.2023.3342689)

This list was generated on Sun Dec 22 14:11:29 2024 UTC.