Items where Author is "Rajaguru, Pushpa"
Article
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tilford, Tim
ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226
(2023)
Damage mechanics-based failure prediction of wirebond in power electronic module.
IEEE Access.
ISSN 2169-3536
(doi:10.1109/ACCESS.2023.3342689)
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina
(2020)
Modelling and analysis of vibration on power electronic module structure and application of model order reduction.
Microelectronics Reliability, 110:113697.
ISSN 0026-2714
(doi:10.1016/j.microrel.2020.113697)
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2019)
Time integration damage model for Sn3.5Ag solder interconnect in power electronic module.
IEEE Transactions on Device and Materials Reliability, 19 (1).
ISSN 1530-4388 (Print), 1558-2574 (Online)
(doi:10.1109/TDMR.2019.2891949)
Book Section
Flynn, David, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Rajaguru, Pushpa
ORCID: https://orcid.org/0000-0002-6041-0517, Wenshuo, Tang and Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420
(2019)
Prognostics and health management of subsea cables.
In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.)
Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data.
Quality and Reliability Engineering Series
.
Wiley-Blackwell.
ISBN 978-1119356653
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David
(2010)
Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development.
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010.
IEEE Computer Society, Piscataway NJ.
ISBN 9781424470266
(doi:10.1109/ESIME.2010.5464573)
Conference Proceedings
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa
ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard
(2010)
Reduced order modelling for risk mitigation in design of miniaturised/integrated products.
In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings.
IEEE Computer Society, Piscataway, USA, pp. 402-407.
ISBN 9781424478491 (print), 9781424478507 (online)
(doi:10.1109/ISSE.2010.5547362)
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa
ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2010)
Reduced order modelling for reliability optimisation of advanced micro-systems.
In: EngOpt2010 2nd International Conference on Engineering Optimization.
International Conference on Engineering Optimization
(2).
EngOpt2010, pp. 1-10.