Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R. ORCID: https://orcid.org/0000-0002-6041-0517, Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Pavuluri, S., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.