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Items where Author is "Parrott, A.K."

Items where Author is "Parrott, A.K."

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Black-Scholes equation coupled solution cure process encapsulant encapsulant curing finite-difference schemes heating microwave curing microwave processing multiphysics analysis nonlinear volatility 1. INTRODUCTION numerical analysis numerical simulation option pricing resonant cavity thermal stresses thermosetting polymer Variable Frequency Microwave (VFM) system waveguide resonator
Number of items: 20.

Black-Scholes equation

Lai, C.-H. ORCID: 0000-0002-7558-6398 , Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:https://doi.org/10.1016/j.camwa.2004.03.014)

coupled solution

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

cure process

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

encapsulant

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

encapsulant curing

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

finite-difference schemes

Lai, C.-H. ORCID: 0000-0002-7558-6398 , Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:https://doi.org/10.1016/j.camwa.2004.03.014)

heating

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

microwave curing

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

microwave processing

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

multiphysics analysis

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

nonlinear volatility 1. INTRODUCTION

Lai, C.-H. ORCID: 0000-0002-7558-6398 , Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:https://doi.org/10.1016/j.camwa.2004.03.014)

numerical analysis

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

numerical simulation

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

option pricing

Lai, C.-H. ORCID: 0000-0002-7558-6398 , Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:https://doi.org/10.1016/j.camwa.2004.03.014)

resonant cavity

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

thermal stresses

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

thermosetting polymer

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

Variable Frequency Microwave (VFM) system

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)

waveguide resonator

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

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