Article

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: 0000-0001-8307-6403 , Bailey, C. ORCID: 0000-0002-9438-3879 and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:https://doi.org/10.1109/TMTT.2008.2005925)

Lai, C.-H. ORCID: 0000-0002-7558-6398 , Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:https://doi.org/10.1016/j.camwa.2004.03.014)

Conference Proceedings

Tilford, T., Parrott, A.K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879 , Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525086)