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Items where Author is "Pang, C.H."

Items where Author is "Pang, C.H."

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adhesive curing glass transition temperature loss modulus storage modulus
Number of items: 5.

adhesive

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

curing

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

glass transition temperature

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

loss modulus

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

storage modulus

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2007.05.045)

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