constitutive modeling

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:https://doi.org/10.1016/j.polymer.2019.121818)

Electromyography

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID: 0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:https://doi.org/10.1007/978-981-10-9038-7_104)

Ergonomics

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID: 0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:https://doi.org/10.1007/978-981-10-9038-7_104)

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Microelectronics

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)

nonlinear rate-dependent response

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:https://doi.org/10.1016/j.polymer.2019.121818)

Orthosis

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID: 0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:https://doi.org/10.1007/978-981-10-9038-7_104)

Parkinson’s disease

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID: 0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:https://doi.org/10.1007/978-981-10-9038-7_104)

polypropylene

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:https://doi.org/10.1016/j.polymer.2019.121818)

semicrystalline polymers

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:https://doi.org/10.1016/j.polymer.2019.121818)

Solder thermal interface materials

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)

solders

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

thermal interface materials

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Thermal resistance

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)

Three-dimensional

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)

Virtual testing

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)

Void morphology

Okereke, Michael I. ORCID: 0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:https://doi.org/10.1016/j.applthermaleng.2018.07.002)