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Items where Author is "Okereke, Michael I."

Items where Author is "Okereke, Michael I."

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Group by: Item Type | Uncontrolled Keywords | No Grouping
bioresorbable3D printing constitutive modeling coronary artery stents drug-coating Electromyography Ergonomics fatigue lead-free Microelectronics nonlinear rate-dependent response Orthosis Parkinson’s disease polypropylene semicrystalline polymers Solder thermal interface materials solders structural response thermal interface materials Thermal resistance Three-dimensional virtual testing Void morphology
Number of items: 23.

bioresorbable3D printing

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Khalaj, Roxanne ORCID logoORCID: https://orcid.org/0000-0002-9342-5555, Tabriz, Atabak Ghanizadeh, Nandi, Uttom, Scoutaris, Nick and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2022) Development of 3D printable bioresorbable drug eluting coronary stents: an experimental and computational investigation. Journal of Drug Delivery Science and Technology, 79:103952. ISSN 1773-2247 (Print), 2588-8943 (Online) (doi:10.1016/j.jddst.2022.103952)

constitutive modeling

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:10.1016/j.polymer.2019.121818)

coronary artery stents

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Khalaj, Roxanne ORCID logoORCID: https://orcid.org/0000-0002-9342-5555, Tabriz, Atabak Ghanizadeh, Nandi, Uttom, Scoutaris, Nick and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2022) Development of 3D printable bioresorbable drug eluting coronary stents: an experimental and computational investigation. Journal of Drug Delivery Science and Technology, 79:103952. ISSN 1773-2247 (Print), 2588-8943 (Online) (doi:10.1016/j.jddst.2022.103952)

drug-coating

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Khalaj, Roxanne ORCID logoORCID: https://orcid.org/0000-0002-9342-5555, Tabriz, Atabak Ghanizadeh, Nandi, Uttom, Scoutaris, Nick and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2022) Development of 3D printable bioresorbable drug eluting coronary stents: an experimental and computational investigation. Journal of Drug Delivery Science and Technology, 79:103952. ISSN 1773-2247 (Print), 2588-8943 (Online) (doi:10.1016/j.jddst.2022.103952)

Electromyography

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:10.1007/978-981-10-9038-7_104)

Ergonomics

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:10.1007/978-981-10-9038-7_104)

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

Microelectronics

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

nonlinear rate-dependent response

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:10.1016/j.polymer.2019.121818)

Orthosis

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:10.1007/978-981-10-9038-7_104)

Parkinson’s disease

Andrade, Adriano O., Bourget, Julien, Costa, Samila, Pereira, Adriano, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Vieira, Marcus Fraga (2018) Ergonomic assessment of an active orthosis for the rehabilitation of flexion and extension of Wrist. In: World Congress on Medical Physics and Biomedical Engineering 2018. IFMBE Proceedings, 68/2 . Springer, Singapore, pp. 565-568. ISBN 978-9811090370 ISSN 1680-0737 (Print), 978-9811090387 (Online) (doi:10.1007/978-981-10-9038-7_104)

polypropylene

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:10.1016/j.polymer.2019.121818)

semicrystalline polymers

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Akpoyomare, Ambrose I. (2019) Two-process constitutive model for semicrystalline polymers across a wide range of strain rates. Polymer, 183:121818. ISSN 0032-3861 (doi:10.1016/j.polymer.2019.121818)

Solder thermal interface materials

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

solders

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

structural response

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Khalaj, Roxanne ORCID logoORCID: https://orcid.org/0000-0002-9342-5555, Tabriz, Atabak Ghanizadeh, Nandi, Uttom, Scoutaris, Nick and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2022) Development of 3D printable bioresorbable drug eluting coronary stents: an experimental and computational investigation. Journal of Drug Delivery Science and Technology, 79:103952. ISSN 1773-2247 (Print), 2588-8943 (Online) (doi:10.1016/j.jddst.2022.103952)

thermal interface materials

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

Thermal resistance

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Three-dimensional

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

virtual testing

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Khalaj, Roxanne ORCID logoORCID: https://orcid.org/0000-0002-9342-5555, Tabriz, Atabak Ghanizadeh, Nandi, Uttom, Scoutaris, Nick and Douroumis, Dennis ORCID logoORCID: https://orcid.org/0000-0002-3782-0091 (2022) Development of 3D printable bioresorbable drug eluting coronary stents: an experimental and computational investigation. Journal of Drug Delivery Science and Technology, 79:103952. ISSN 1773-2247 (Print), 2588-8943 (Online) (doi:10.1016/j.jddst.2022.103952)

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Void morphology

Okereke, Michael I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

This list was generated on Sat Dec 13 03:08:14 2025 UTC.