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Items where Author is "Musallam, M."

Items where Author is "Musallam, M."

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Number of items: 5.

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:10.1109/ECCE.2010.5617883)

Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

Yin, C.Y. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

Yin, C.Y, ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

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