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Items where Author is "Muller, G."

Items where Author is "Muller, G."

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curing curing encapsulant materials electromagnetic heating electronics packaging encapsulation microwave oven open-ended applicator open-ended microwave oven packaging thermal processing
Number of items: 10.

curing

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

curing encapsulant materials

Adamietz, R., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

electromagnetic heating

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

electronics packaging

Adamietz, R., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

encapsulation

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

open-ended applicator

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

open-ended microwave oven

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Adamietz, R., Muller, G., Eicher, F. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

thermal processing

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

This list was generated on Sun Dec 22 13:41:22 2024 UTC.