Article

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:10.1007/s40033-014-0063-3)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:10.1108/SSMT-07-2013-0019)

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:10.6117/kmeps.2014.21.4.001)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:10.11648/j.ijmsa.20140305.27)

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:10.1007/s12540-013-5025-z)

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-012-0360-7)

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:10.1016/j.matdes.2011.02.045)

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:10.1108/09540911111120140)

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

Book Section

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:10.1007/978-94-017-8832-8_3)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417065)

Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:10.1109/ESTC.2006.280132)

Book

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

Conference Proceedings

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145164)

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684512)

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)

Conference or Conference Paper

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

Thesis

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.