Items where Author is "Mallik, S."

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advanced characterization attenuation automotive automotive applications carbon nanofibres (CNFs) carbon nanotubes (CNTs) cement-based materials chemical vapour deposition (CVD) chip scale package (CSP) technology chip-scale packaged power device computer-aided design of microcircuits contacts defective metallisation device isolation electronic control unit electronic control unit (ECU) electronic materials electronic unit electronics assembly applications Euro 6 standard fatigue failure finite element analysis finite element analysis (FEA) flip-chip flipchips flux high temperature electronics integrated circuits interconnected systems interconnects interface isotropic conductive adhesives layout and modeling lead-free lead-free solder lead-free solder paste lead-free soldering life prediction linear visco-elastic materials metal matrix composites metallization microstructure modeling processes nanotechnology out-gassing phenomenon Pb-free solder processing technology reflow profile rheological characterisation rheology solder deposit solder joint reliability solder paste solder pastes solder thermal interface materials (STIMs) soldering stencil printing stencil printing process stress stretched exponential model surface mount components surface mount packages surface tension Surface tension and related phenomena thermal thermal cycling thermal fatigue thermal interface material thermal interface materials (TIMs) thermal management three-dimensional finite element analysis time-dependent behaviors transfer efficiency under-hood automotive ambient viscoelasticity viscosity wall-slip wall-slip behavior wall-slip effects Workshop procedures

Number of items: 112.

advanced characterization

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)

attenuation

Marks, A.E., Mallik, S., Ekere, N.N. and Seman, A. (2008) Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 829-832. ISBN 97814244-28137 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684459)

automotive

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)

automotive applications

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)

carbon nanofibres (CNFs)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)

carbon nanotubes (CNTs)

cement-based materials

chemical vapour deposition (CVD)

chip scale package (CSP) technology

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)

chip-scale packaged power device

computer-aided design of microcircuits

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:10.1063/1.3552465)

contacts

defective metallisation

device isolation

electronic control unit

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

electronic control unit (ECU)

electronic materials

electronic unit

electronics assembly applications

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)

Euro 6 standard

fatigue failure

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)

finite element analysis

finite element analysis (FEA)

flip-chip

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

flipchips

Mallik, S., Schmidt, M., Bauer, R. and Ekere, N.N. (2010) Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance. Soldering & Surface Mount Technology, 22 (4). pp. 42-49. ISSN 0954-0911 (doi:10.1108/09540911011076871)

flux

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

high temperature electronics

integrated circuits

interconnected systems

interconnects

interface

isotropic conductive adhesives

Durairaj, R., Mallik, S., Seman, A. and Ekere, N.N. (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 799-810. ISSN 0256-2499 (Print), 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2008) Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly. In: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 1-8. ISBN 9781424433926 (print), 9781424433933 (electronic) ISSN 1089-8190 (doi:10.1109/IEMT.2008.5507801)

layout and modeling

lead-free

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

lead-free solder

lead-free solder paste

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.01.028)

lead-free soldering

Bernasko, P.K., Mallik, S., Ekere, N.N., Seman, A. and Tayki, G. (2010) Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In: Electronics Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 986-990. ISBN 978-1-4244-5100-5 (electronic), 978-1-4244-5099-2 (print) (doi:10.1109/EPTC.2009.5416398)

life prediction

linear visco-elastic

materials

metal matrix composites

Mallik, S. and Ekere, N. (2013) Metal matrix composites as thermal management materials for automotive applications. In: Magagnin, Luca, (ed.) Engineered Metal Matrix Composites: Forming Methods, Material Properties and Industrial Applications. Nova Science Publishers, Inc., New York, USA, pp. 113-126. ISBN 9781620817193

metallization

microstructure

modeling processes

nanotechnology

out-gassing phenomenon

Pb-free solder

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)