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Items where Author is "Kotadia, H."

Items where Author is "Kotadia, H."

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atomic diffusions atomic vacancies current loadings Electromigration EM simulations finite element method Modelling multi-physics numerical modeling Solder material Thermomigration Thin film void formation voids evolution
Number of items: 15.

atomic diffusions

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

atomic vacancies

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

current loadings

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

EM simulations

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

finite element method

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

Modelling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

multi-physics

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

numerical modeling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

Solder material

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Thermomigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

void formation

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S.H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:https://doi.org/10.1109/ICEPT.2013.6756527)

This list was generated on Mon Nov 25 12:14:00 2024 UTC.