Article

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Book Section

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.