Article

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Conference Proceedings

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249