Items where Author is "Jackson, G.J."

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rheology solder pastes stencils

Number of items: 3.

rheology

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

solder pastes

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

stencils

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

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