Items where Author is "Jackson, G.J."
![[up]](/style/images/multi_up.png)
Up a levelNumber of items: 1.
Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. 
ORCID: https://orcid.org/0000-0002-9438-3879
(2002)
Correlation of solder paste rheology with computational simulations of the stencil printing process.
Soldering and Surface Mount Technology, 14 (1).
pp. 11-17.
ISSN 0954-0911
(doi:10.1108/09540910210416422)