Skip navigation

Items where Author is "Hung, K.C."

Items where Author is "Hung, K.C."

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
computer simulation curing delamination electroless Ni–P layer fatigue of materials flip chip devices flip-chip assembly interfaces (materials) microelectronic processing no-flow underfill materials reliability study scanning acoustic microscopes solder alloy soldered joints X ray microscopes
Number of items: 15.

computer simulation

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

curing

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

delamination

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

electroless Ni–P layer

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

fatigue of materials

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

flip chip devices

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

flip-chip assembly

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

interfaces (materials)

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

microelectronic processing

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

no-flow underfill materials

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

reliability study

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

scanning acoustic microscopes

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

solder alloy

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

soldered joints

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

X ray microscopes

Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

This list was generated on Sun Dec 22 13:11:20 2024 UTC.