Article

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Hung, K.C., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

Conference Proceedings

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114