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Items where Author is "Glinski, G.P."

Items where Author is "Glinski, G.P."

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adhesive flows adhesives CFD computational fluid dynamics conducting polymers conductive adhesive dense suspension filled polymers finite difference time-domain analysis finite volume method flip-chip devices heat conduction Maxwell equations microwave cure microwave heating modelling polymerisation multi-scale computational simulations non-Newtonian solder paste stencil printing temperature distribution thermal expansion thermal management (packaging)
Number of items: 23.

adhesive flows

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

adhesives

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

CFD

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

computational fluid dynamics

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

conducting polymers

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

conductive adhesive

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

dense suspension

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

filled polymers

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

finite difference time-domain analysis

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

finite volume method

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

flip-chip devices

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

heat conduction

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Maxwell equations

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

microwave cure

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

microwave heating

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

modelling polymerisation

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

multi-scale computational simulations

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

non-Newtonian

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

solder paste

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

stencil printing

Glinski, G.P., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, K.A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

temperature distribution

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

thermal expansion

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

thermal management (packaging)

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

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