Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 , Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

Glinski, G.P. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012543)

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K.A. ORCID: 0000-0002-7426-9999 (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:https://doi.org/10.1243/0954406011520869)