Items where Author is "Glinski, G."
rheology
Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2002)
Correlation of solder paste rheology with computational simulations of the stencil printing process.
Soldering and Surface Mount Technology, 14 (1).
pp. 11-17.
ISSN 0954-0911
(doi:10.1108/09540910210416422)
solder pastes
Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2002)
Correlation of solder paste rheology with computational simulations of the stencil printing process.
Soldering and Surface Mount Technology, 14 (1).
pp. 11-17.
ISSN 0954-0911
(doi:10.1108/09540910210416422)
stencils
Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2002)
Correlation of solder paste rheology with computational simulations of the stencil printing process.
Soldering and Surface Mount Technology, 14 (1).
pp. 11-17.
ISSN 0954-0911
(doi:10.1108/09540910210416422)