Article

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

Conference or Conference Paper

Glinski, G., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2000) A computational fluid dynamics study of the stencil printing process. In: 8th Annual Conference of the Association for Computational Mechanics in Engineering (ACME 2000), 16-19 April 2000, University of Greenwich, London, UK.