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Items where Author is "Flyyn, D."

Items where Author is "Flyyn, D."

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electrodeposition electrodeposition of copper fluid flow megasonic agitation micro-particle imaging velocimetry (micro-PIV)
Number of items: 5.

electrodeposition

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electrodeposition of copper

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

fluid flow

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

megasonic agitation

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

micro-particle imaging velocimetry (micro-PIV)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

This list was generated on Sun Dec 22 13:19:31 2024 UTC.