Items where Author is "Ekere, N"
 | Up a level |
Jump to: Book Section
Number of items: 1.
Book Section
Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.