damage modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

failure

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

finite element analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

machine learning

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

metamodel

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

ML

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

power electronic module

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)

wire bonds

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy ORCID: 0000-0001-8307-6403 , Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:https://doi.org/10.1109/EuroSimE60745.2024.10491522)