Conference Proceedings

Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy ORCID: https://orcid.org/0000-0001-8307-6403, Zhang, Xiaotian, Hu, Yihua, Yang, Xingyu and Shen, Yaochun (2024) Physics-informed Machine Learning for predicting fatigue damage of wire bonds in power electronic modules. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE Xplore (IEEE digital library) . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 979-8350393644 ISSN 2833-8596 (Print), 2833-8553 (Online) (doi:10.1109/EuroSimE60745.2024.10491522)