Garofalo equation

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

Miner's law of linear damage accumulation

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

SnPb and SnAgCu (solder alloys)

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)

thick film chip resistors

Rizvi, M.J., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 , Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:https://doi.org/10.1109/IMPACT.2010.5699488)