Items where Author is "Coates, J."
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Number of items: 1.
Conference Proceedings
Rizvi, M.J., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879, Bevan, E., Poutney, N. and Coates, J.
(2010)
Finite element modelling of failures in thick film chip resistor solder joints.
In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010.
in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010
.
IEEE Xplore Digital Library, Taipei, pp. 1-4.
ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print)
ISSN 2150-5934
(doi:10.1109/IMPACT.2010.5699488)