electric-thermal

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

finite element method

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

flip-chip assembly

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

no-flow underfill materials

Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

numerical modeling

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

optimization

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

power module

Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2014) The optimization of thermal performance in power electronics modules. In: 2014 15th International Conference on Electronic Packaging Technology. Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739. ISBN 978-1-4799-4707-2 (doi:10.1109/ICEPT.2014.6922755)

voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)