Items where Author is "Bi, Keyun"
Conference Proceedings
Evans, Paul, Castellazzi, Alberto, Johnson, C. Mark, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2014)
The optimization of thermal performance in power electronics modules.
In: 2014 15th International Conference on Electronic Packaging Technology.
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 734-739.
ISBN 978-1-4799-4707-2
(doi:10.1109/ICEPT.2014.6922755)
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S.H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C.
(2013)
Comments on electromigration analysis methods.
In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013).
Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534.
ISBN 9781479904983
(doi:10.1109/ICEPT.2013.6756527)
Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, S.
ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879, Hung, K.C. and Chan, Y.C.
(2001)
A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly.
In: Proceedings of the 4th International Symposium on Electronic Packaging Technology.
Institute of Electrical and Electronics Engineers, Inc., pp. 338-343.
ISBN 0780398114