(MTO)

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

Al/SiC

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

aluminium

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

chip

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

coefficient of thermal expansion

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Computer Aided Design and Manufacturing (CAD/CAM)

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

cost

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

density

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

electronic control unit

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

Enterprise Resource Planning (ERP)

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

file type

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

heat sink geometry

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

make to order

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

management systems

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

metal matrix composites

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

micro-contact

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

micro-gap

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

microelectronics

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

Modular architecture

Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

Modular Product Structure

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Product data and knowledge management

Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

Product Development

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Product Life Cycle Management (PLM)

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

Product lifecycle management

Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Product structure and information model

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

rapid prototyping

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

SMEs

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

software errors

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

solders

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

STL file generation

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X

thermal conductive polymer

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal conductivity

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

thermal constriction

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

thermal efficiency

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

thermal interface material

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal interface materials

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

thermal management

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal management materials

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

tolerance

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X