Giddaluru, Muni Prasad, Gao, James X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2017) Integrating product knowledge with modular product structures in PLM. In: ICIDM2017: International Conference on Innovative Design and Manufacturing, July 17-19, 2017, Milan, Italy.

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) A modular product structure based methodology for seamless information flow in PLM system implementation. Computer-Aided Design and Applications, 12 (6). pp. 742-752. ISSN 1686-4360 (Print), 1686-4360 (Online) (doi:https://doi.org/10.1080/16864360.2015.1033339)

Giddaluru, Muni Prasad, Gao, J.X. ORCID: 0000-0001-5625-3654 and Bhatti, Raj (2015) Incorporating modular structure principles for global product development knowledge management in PLM system implementation. In: Proceedings of the 13th International Conference on Manufacturing Research (ICMR2015). Not known, pp. 123-128.

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Pillai, Sreejit, Arokiam, Alan, Bhatti, Raj and Collins, T. (2011) Make to order manufacturing and operational management strategies – a case study at Priorclave Ltd. In: 18th International Annual EurOMA Conference: Exploring Interfaces, 3-6 Jul 2011, Cambridge, UK. (Unpublished)

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

Chowdary, Boppana V., Sahatoo, Divesh R. and Bhatti, Raj (2007) Some STL file generation issues in rapid prototyping. In: Esparragoza, Ivan E., Bermudez, Manuel and Petrie, Maria Larrondo, (eds.) 5th Latin American and Caribbean Conference for Engineering and Technology Developing Entrepreneural Engineers for the Sustainable Growth of Latin American and Caribbean: Education, Innovation, Technology, and Practice. Latin American and Caribbean Consortium of Engineering Institutions, Florida. ISBN 098228960X