Items where Author is "Best, Chris"
Article
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226
(2015)
Statistical analysis of the impact of refinishing process on leaded components.
Microelectronics Reliability, 55 (2).
pp. 424-431.
ISSN 0026-2714
(doi:10.1016/j.microrel.2014.11.001)
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879, Alam, M.O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim
(2013)
Modelling methodology for thermal analysis of hot solder dip process.
Microelectronics Reliability, 53 (8).
pp. 1055-1067.
ISSN 0026-2714
(doi:10.1016/j.microrel.2013.02.018)
Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)
Conference Proceedings
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:10.1109/ISSE.2012.6273091)
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Best, Chris, Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420, Alam, M.O., Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Tollafield, Peter
(2012)
Experimental and modelling study on the effects of refinishing lead-free microelectronic components.
In: 2012 4th Electronic System-Integration Technology Conference (ESTC).
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.
ISBN 9781467346450
(doi:10.1109/ESTC.2012.6542213)