Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201