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Items where Author is "Bella, Martina"

Items where Author is "Bella, Martina"

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Model order reduction power electronic module vibration wirebond
Number of items: 5.

Model order reduction

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

power electronic module

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

vibration

Rajaguru, Pushpa ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:10.1016/j.microrel.2020.113697)

wirebond

Rajaguru, Pushparajah ORCID logoORCID: https://orcid.org/0000-0002-6041-0517, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:10.1109/THERMINIC52472.2021.9626396)

This list was generated on Sun Dec 22 14:38:39 2024 UTC.