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Items where Author is "Bella, Martina"

Items where Author is "Bella, Martina"

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Model order reduction power electronic module vibration wirebond
Number of items: 5.

Model order reduction

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

vibration

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Bella, Martina (2020) Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Microelectronics Reliability, 110:113697. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2020.113697)

wirebond

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

This list was generated on Thu Nov 21 21:35:40 2024 UTC.