Items where Author is "Alam, Mohammad"
![]() | Up a level |
(HSD)
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
copper
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
electronic packaging thermal management
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
hot solder dip
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
leaded components
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
predictive models
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
stress
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
thermal stresses
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
thermomechanical processes
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)
wires
Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Best, Chris, Alam, Mohammad, Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Tollafield, Peter, Parker, Mike and Scott, Jim
(2012)
Modelling and testing the impact of hot solder dip process on leaded components.
In: 2012 35th International Spring Seminar on Electronics Technology.
IEEE Conference Publications
.
Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308.
ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online)
ISSN 2161-2528
(doi:https://doi.org/10.1109/ISSE.2012.6273091)