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Items where Author is "Alam, M.O."

Items where Author is "Alam, M.O."

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(HSD) (QFP) 63Sn37Pb solder joints adhesives in electronics alloying additions and alloys and failure anisotropic conductive film (ACF) Au/Ni metallization automotive ball grid array (BGA) BGA brittleness butt joints chip scale package (CSP) technology contact resistance copper alloys corrosion fatigue cracking Cu trace current stressing defective metallisation dissolving effect of reflow process electroless Ni–P layer electromigration electronic components electronic package electronic packaging electronic unit embrittlement eutectic alloys failure analysis fatigue finite element analysis (FEA) finite element modeling fracture fracture mechanics heat dissipation Hot Solder Dip hot solder dip process integrated circuit integrated circuit metallisation interface interfacial reaction intermetallic intermetallic compound Joule heating metals miniaturized consumer electronic products modelling methodology modelling techniques nucleation out-gassing phenomenon pb-free plastic deformation Quad Flat Package reliability reliability study semimetals silver alloys solder solder alloy solder joint solder joints solder thermal interface materials (STIMs) soldering stress intensity factor surface mount packages thermal thermal analysis through-hole packages tin alloys tin whiskers
Number of items: 80.

(HSD)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

(QFP)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

63Sn37Pb solder joints

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

adhesives in electronics

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

alloying additions

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

and alloys

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

and failure

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

anisotropic conductive film (ACF)

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

automotive

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

ball grid array (BGA)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

BGA

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

brittleness

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

butt joints

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

chip scale package (CSP) technology

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

contact resistance

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

copper alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

corrosion fatigue

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

cracking

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Cu trace

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

current stressing

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

defective metallisation

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

dissolving

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

effect of reflow process

Yin, C.Y. ORCID: 0000-0003-0298-0420 , Alam, M.O., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00348-7)

electroless Ni–P layer

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

electromigration

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

electronic components

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

electronic package

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

electronic packaging

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

embrittlement

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

eutectic alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

failure analysis

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

fatigue

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

finite element modeling

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

fracture

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

fracture mechanics

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

heat dissipation

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

Hot Solder Dip

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

hot solder dip process

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

integrated circuit

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

integrated circuit metallisation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

interface

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

interfacial reaction

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

intermetallic

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

intermetallic compound

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

Joule heating

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

metals

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

miniaturized consumer electronic products

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

modelling methodology

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

modelling techniques

Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Modelling techniques used to assess conductive adhesive properties. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

nucleation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

out-gassing phenomenon

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

pb-free

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

plastic deformation

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

Quad Flat Package

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Alam, M.O., Bailey, Chris ORCID: 0000-0002-9438-3879 and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:https://doi.org/10.1109/ESTC.2012.6542213)

reliability

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

reliability study

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

semimetals

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

silver alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

solder

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

solder alloy

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:https://doi.org/10.1016/S0026-2714(02)00068-9)

solder joint

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2008.2010595)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

solder joints

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

solder thermal interface materials (STIMs)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

soldering

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

stress intensity factor

Alam, M.O., Lu, H. ORCID: 0000-0002-4392-6562 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:https://doi.org/10.1016/j.commatsci.2008.12.001)

surface mount packages

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

thermal

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

through-hole packages

Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Introduction to adhesives joining technology for electronics. In: Alam, M.O. and Bailey, C. ORCID: 0000-0002-9438-3879 , (eds.) Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

tin alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Alam, M.O., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.02.018)

This list was generated on Thu Nov 21 20:34:26 2024 UTC.