Wheeler, Daniel and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (1999) Modelling the melting and solidification of solder material. In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference. American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404. ISBN 978-0791816127

Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Boettinger, W. (1999) Modelling the fillet lifting defect. In: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99. American Society of Mechanical Engineers, New Yor, NY, USA, pp. 405-413. ISBN 9780791816127