2010

Seman, Anton (2010) On-line non-destructive ultrasonic rheology measurement of solder pastes. PhD thesis, University of Greenwich.

Bernasko, P.K., Mallik, S., Ekere, N.N., Seman, A. and Tayki, G. (2010) Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In: Electronics Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 986-990. ISBN 978-1-4244-5100-5 (electronic), 978-1-4244-5099-2 (print) (doi:https://doi.org/10.1109/EPTC.2009.5416398)

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-009-9448-0)

2009

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

Durairaj, R., Mallik, S., Seman, A. and Ekere, N.N. (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 799-810. ISSN 0256-2499 (Print), 0973-7677 (Online) (doi:https://doi.org/10.1007/s12046-009-0046-5)

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.01.028)

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.05.028)

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416511)

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

2008

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Marks, A.E., Mallik, S., Ekere, N.N. and Seman, A. (2008) Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 829-832. ISBN 97814244-28137 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684459)

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2008) Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly. In: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 1-8. ISBN 9781424433926 (print), 9781424433933 (electronic) ISSN 1089-8190 (doi:https://doi.org/10.1109/IEMT.2008.5507801)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684527)