Items where Greenwich Author is "Zhu, Xiaoxin"

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Jump to: City University of Hong Kong Research project:7002848 (A study of functionalized CNT/grapheme reinforced composite electronic interconnects: preparation, characterization and integration for green nanoelectronicapplications) | HK RGC GRF (Project No. 111309; City University of Hong Kong, Ref No: 9041486) (SX) | Research Grants Council, Hong Kong, Ref. No. 9041636 (A study of nanostructured electronic interconnects-preparation, characterization and integration) | University of Greenwich | University of Greenwich (University Bursary Ref. No: RAE Fund 13265-R09803) (XZ)

Number of items: 5.

City University of Hong Kong Research project:7002848 (A study of functionalized CNT/grapheme reinforced composite electronic interconnects: preparation, characterization and integration for green nanoelectronicapplications)

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

HK RGC GRF (Project No. 111309; City University of Hong Kong, Ref No: 9041486) (SX)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

Research Grants Council, Hong Kong, Ref. No. 9041636 (A study of nanostructured electronic interconnects-preparation, characterization and integration)

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

University of Greenwich

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

University of Greenwich (University Bursary Ref. No: RAE Fund 13265-R09803) (XZ)

Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: 0000-0002-4392-6562 , Mannan, S. H., Bailey, C. ORCID: 0000-0002-9438-3879 and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2014.06.030)

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