Items where Greenwich Author is "Zhu, Xiaoxin"
City University of Hong Kong Research project:7002848 (A study of functionalized CNT/grapheme reinforced composite electronic interconnects: preparation, characterization and integration for green nanoelectronicapplications)
Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2014)
Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits.
In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings.
Curran Associates, Stoughton, WI, USA, pp. 1342-1347.
ISBN 9781479924080
(doi:10.1109/ECTC.2014.6897466)
HK RGC GRF (Project No. 111309; City University of Hong Kong, Ref No: 9041486) (SX)
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C.
(2014)
Electromigration in Sn-Ag solder thin films under high current density.
Thin Solid Films, 565.
pp. 193-201.
ISSN 0040-6090
(doi:10.1016/j.tsf.2014.06.030)
Research Grants Council, Hong Kong, Ref. No. 9041636 (A study of nanostructured electronic interconnects-preparation, characterization and integration)
Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879
(2014)
Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits.
In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings.
Curran Associates, Stoughton, WI, USA, pp. 1342-1347.
ISBN 9781479924080
(doi:10.1109/ECTC.2014.6897466)
University of Greenwich
Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.
University of Greenwich (University Bursary Ref. No: RAE Fund 13265-R09803) (XZ)
Zhu, X., Kotadia, H., Xu, S., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Mannan, S. H., Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y. C.
(2014)
Electromigration in Sn-Ag solder thin films under high current density.
Thin Solid Films, 565.
pp. 193-201.
ISSN 0040-6090
(doi:10.1016/j.tsf.2014.06.030)