Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

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Abstract

This study presents a new approach for conducting parametric analyses via exploring model parameters of a power electronics module (PEM) thermal model, integrating finite element analysis (FEA) with a parametric model order reduction (pMOR) method. A three-dimensional model has been utilised for thermal analyses using a pMOR method, parametrising the heat-source parameter, i.e., the internal heat generation (IHG) rate, and the convection parameter, i.e., the film coefficient of the coolant's channel surface, of the PEM. This approach allows for the exploration of various cyclic thermal loads observed in power cycle experiments. The ‘pMOR by matrix interpolation’ method has been employed for the global parametric reducedorder modelling study, and PRIMA, a Krylov subspace and Arnoldi process-based model order reduction (MOR) technique, for local model order reductions and the generalised trapezoidal rule (GTR) for numerical analysis procedure, have been utilised within the modelling procedure. The local models of the parametric reduced-order model (pROM) have a total degree of freedom (DOF) of just 20, in contrast to the local models of the parametric full-order model's (pFOM) total DOF of 185,489. The pROM solutions have been validated by comparing corresponding pFOM solutions and experimental data, which demonstrate that the proposed parametric reduced-order modelling approach provides valid solutions and significantly reduces computational requirements, e.g., time, by over 99 % for the case presented. The developed parametric reduced-order modelling approach for thermal analyses, addressing the parametric (global) analysis of power electronic components, has been implemented via MATLAB programming (.m) environments.

Item Type:	Conference Proceedings
Title of Proceedings:	25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France
Uncontrolled Keywords:	Model Order Reduction (MOR), Parametric Model Order Reduction (pMOR), Finite Element Analysis (FEA), thermal analysis, Power Electronics Module (PEM)
Subjects:	Q Science > Q Science (General) Q Science > QA Mathematics > QA75 Electronic computers. Computer science T Technology > T Technology (General)
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS)
Last Modified:	17 Nov 2025 11:35
URI:	https://gala.gre.ac.uk/id/eprint/51580

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