Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

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Abstract

In the field of IGBT modules, there is currently a plethora of new packaging materials being developed with a view to increased “reliability”. Whilst this approach is often essential to meet the needs for the ever increased demand in harsher environments, the result can often be seen as an over-engineered solution with resultant excessive cost. This paper will present a case study addressing how process control techniques of the substrate solder can demonstrate a significant improvement in the reliability of the product.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Additional Information:	[1] First available online: 23 September 2010. [2] This paper was presented at the 11th International Conference on Electronic Packaging Technology and High Density Packaging, (ICEPT-HDP 2010), held from 16-19 August 2010 in Xi'an, China. [3] ISBN: 97814244-81408; 9781424481422; 9781424481415. [4] INSPEC Accession Number: 11555870.
Uncontrolled Keywords:	copper, insulated gate bipolar transistors, multichip modules, reliability, soldering, substrates
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/4461

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