Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Boettinger, W. (1999) Modelling the fillet lifting defect. In: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99. American Society of Mechanical Engineers, New Yor, NY, USA, pp. 405-413. ISBN 9780791816127

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Item Type:	Conference Proceedings
Title of Proceedings:	Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99
Additional Information:	International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii sponsored by the Electrical and Electronic Packaging Division, ASME.
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/343

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