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Number of items: 5.

D

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:10.1108/09540910210416422)

M

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:10.1108/09540911111120140)

S

Stoyanov, S., Bailey, C. and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

T

Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:10.1108/09540911111120186)

Takyi, G. and Ekere, N.N. (2010) Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs. Soldering and Surface Mount Technology, 22 (3). pp. 17-21. ISSN 0954 0911 (doi:10.1108/09540911011054154)

This list was generated on Sat Apr 21 14:33:10 2018 BST.