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Number of items: 10.

Article

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:10.1108/SSMT-07-2013-0019)

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)

Mallik, S., Schmidt, M., Bauer, R. and Ekere, N.N. (2010) Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance. Soldering & Surface Mount Technology, 22 (4). pp. 42-49. ISSN 0954-0911 (doi:10.1108/09540911011076871)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

Stoyanov, Stoyan, Bailey, Chris and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:10.1108/09540910910928265)

Takyi, G. and Ekere, N.N. (2010) Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering. Soldering & Surface Mount Technology, 22 (2). pp. 37-42. ISSN 0954-0911 (doi:10.1108/09540911011036271)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

This list was generated on Wed Apr 25 15:46:58 2018 BST.