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M

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-012-0360-7)

This list was generated on Thu Apr 19 08:57:28 2018 BST.