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Items where Faculty / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

Items where Faculty / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

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Article

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

Alessandri, E., Mawhinney, R.N., Patel, Mayur and Galea, Edwin R. (1996) Revisiting the carrier-phase source-term formulation in mixed Lagrangian-Eulerian particle models. Numerical Heat Transfer, Part B: Fundamentals, 30 (1). pp. 111-116. ISSN 1521-0626 (electronic) 1040-7790 (paper) (doi:10.1080/10407799608915074)

Bailey, C., Bounds, S., Cross, M., Moran, G, Pericleous, K. and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

Bailey, C., Chow, P., Cross, M., Fryer, Y. and Pericleous, K. (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:10.1098/rspa.1996.0024)

Bailey, C., Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

Bailey, C., Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Bailey, Christopher, Lu, Hua, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:10.1108/03056120210696658)

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

Benson, M., Bennett, C.R., Harry, J.E., Patel, M.K. and Cross, M. (2000) The recovery mechanism of platinum group metals from catalytic converters in spent automotive exhaust systems. Resources, Conservation and Recycling, 31 (1). pp. 1-7. ISSN 0921-3449 (doi:10.1016/S0921-3449(00)00062-8)

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

Chapelle, Pierre, Christakis, Nicholas, Abou-Chakra, Hadi, Bridle, Ian, Bradley, M.S.A., Patel, Mayur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute-phase pneumatic conveying: modeling of dilute-phase pneumatic conveying. Advanced Powder Technology, 15 (1). pp. 31-49. ISSN 0921-8831 (Print), 1568-5527 (Online) (doi:10.1163/15685520460740052)

Chow, P., Bailey, C., Cross, M. and Pericleous, K.A. (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Christakis, N., Chapelle, Pierre and Patel, M. K. (2006) Analysis and modeling of heaping behavior of granular mixtures within a computational mechanics framework. Advanced Powder Technology, 17 (4). pp. 383-398. ISSN 0921-8831 (doi:10.1163/156855206777866173)

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:10.1080/135048699334528)

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. and Pericleous, K. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

Cross, M., Lyster, C, Bailey, C., Croft, N., Ewer, J., Leggett, P., McManus, K., Pericleous, K.A. and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Cross, Mark, Bailey, Christopher, Pericleous, Koulis, Williams, Alison, Bojarevics, Valdis, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

Deng, T., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of particle concentration on erosion rate of mild steel bends in a pneumatic conveyor. Wear, 258 (1-4). pp. 480-487. ISSN 0043-1648 (doi:10.1016/j.wear.2004.08.001)

Deng, T., Li, J., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Comparison between weight loss of bends in a pneumatic conveyor and erosion rate obtained in a centrifugal erosion tester for the same materials. Wear, 258 (1-4). pp. 402-411. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.012)

Deng, T., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors. Wear, 258 (1-4). pp. 426-433. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.010)

Dhinsa, Kulvir, Bailey, Chris and Pericleous, Koulis (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) Heat and mass transfer in two-phase porous materials under intensive microwave heating. Journal of Food Engineering, 65 (2). pp. 403-412. ISSN 0260-8774 (doi:10.1016/j.jfoodeng.2004.02.011)

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) A new computational approach to microwave heating of two-phase porous materials. International Journal of Numerical Methods for Heat & Fluid Flow, 14 (6). pp. 783-802. ISSN 0961-5539 (doi:10.1108/09615530410544319)

Dracopoulos, M., Parrott, K., Molinari, G., Nervi, M. and Simkin, J. (1997) Results of parallelisation of existing electromagnetic finite codes on some different parallel architectures. Applied Computational Electromagnetics Society Journal, 12 (2). pp. 107-112. ISSN 1054-4887

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:10.1108/09540910210416422)

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

Ewer, J., Galea, E.R., Patel, M.K., Taylor, S., Knight, B. and Petridis, M. (1999) SMARTFIRE: an intelligent CFD based fire model. Journal of Fire Protection Engineering, 10 (1). pp. 13-27. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159901000102)

Fallah, N.A., Bailey, C., Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00047-5)

Galea, E. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire – Part 1: Prediction of the pre-fire air flow within the cockpit and surrounding areas. The Aeronautical Journal, 110 (1103). ISSN 0001-9240

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2006) A suggested procedure for benchmarking fire field models. International Journal on Engineering Performance-Based Fire Codes, 8 (4). pp. 132-144. ISSN 1561-9559

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

Janssen, R., Dracopoulos, M., Parrott, K., Slessor, E., Alotto, P., Molfino, P., Nervi, M. and Simkin, J. (1998) Parallelisation of electromagnetic simulation codes. IEEE Transactions on Magnetics, 34 (5). pp. 3423-3426. ISSN 0018-9464 (doi:10.1109/20.717806)

Jia, F., Galea, E.R. and Patel, M.K. (1999) Numerical simulation of the mass loss process in pyrolizing char materials. Fire and Materials, 23 (2). pp. 71-78. ISSN 0308-0501 (Print), 1099-1018 (Online) (doi:10.1002/(SICI)1099-1018(199903/04)23:2<71::AID-FAM672>3.0.CO;2-5)

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of fire spread within a compartment using an integrated gas and solid phase combustion model. Journal of Applied Fire Science, 8 (4). pp. 327-352. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/UY41-W38Q-X6KK-TXYV)

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

Jia, F., Patel, M.K., Galea, E.R., Grandison, A. and Ewer, J. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire - part II: fire spread analysis. The Aeronautical Journal of the Royal Aeronautical Society, 110 (1107):3069. pp. 303-314. ISSN 0001-9240

Jia, Fuchen, Galea, Edwin and Patel, Mayur (1998) The numerical simulation of enclosure fires using a Cfd fire field model coupled with a pyrolysis based solid fuel combustion submodel—a first approximation. Journal of Fire Protection Engineering, 9 (4). pp. 1-17. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159800900402)

Jia, Fuchen, Patel, Mayur and Galea, Edwin (2003) Flight simulation. Fire Prevention & Fire Engineers Journal, 2003 (Sept.). pp. 27-29. ISSN 1478-3576

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

Kerrison, L., Galea, E.R. and Patel, M.K. (1998) A two-dimensional numerical investigation of the oscillatory flow behaviour in rectangular fire compartments with a single horizontal ceiling vent. Fire Safety Journal, 30 (4). pp. 357-382. ISSN 0379-7112 (doi:10.1016/S0379-7112(97)00042-8)

Kiani, Nageena, Patel, Mayur and Lai, Choi-Hong (2007) CFD analysis of one-dimensional infiltration in vadose zone. Journal of Algorithms & Computational Technology, 1 (4). pp. 477-493. ISSN 1748-3018 (doi:10.1260/174830107783133897)

Lai, C.-H., Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:10.1016/j.camwa.2004.03.014)

Lee, Chung-Yee and Strusevich, Vitaly A. (2005) Two-Machine Shop Scheduling with an Uncapacitated Interstage Transporter. IIE Transactions, 37 (8). pp. 725-736. ISSN 0740-817X (Print), 1545-8830 (Online) (doi:10.1080/07408170590918290)

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:10.1039/c3ra40188j)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Lu, Hua and Bailey, Christopher (2005) Dynamic analysis of Flip-Chip Self-Alignment. IEEE Transactions on Advanced Packaging, 28 (3). pp. 475-480. ISSN 1521-3323 (doi:10.1109/TADVP.2005.848371)

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:10.1016/S0304-8853(96)00345-9)

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:10.1006/jcph.2001.6753)

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:10.1002/pamm.200700212)

Pericleous, Kyriacos A and Dempsey, Stephen (1995) Turbulent flow simulation using a fractal based LES model. Journal of Fluid Engineering, 208. pp. 61-66.

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

Rafii-Tabar, Hashem, Lu, Hua and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/10/11/003)

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher and Lu, Hua (2005) Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending. Microelectronics Reliability, 4 (5). pp. 589-596. ISSN 0026-2714 (doi:10.1016/j.microrel.2004.10.015)

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2007) Numerical simulation of incompressible flow problems using an unstructured staggered mesh method. Journal of Algorithms and Computational Technology, 1 (3). pp. 273-302. ISSN 1748-3018 (doi:10.1260/174830107782424066)

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

Slone, A.K., Bailey, C. and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:10.1016/S0307-904X(02)00060-4)

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Stoyanov, S., Bailey, C. and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

Stoyanov, Stoyan, Bailey, Chris, Alam, M.O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

Taylor, G.A., Bailey, C. and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:10.1002/nme.574)

Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:10.1016/S0307-904X(01)00063-4)

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Tsirkas, S.A., Papanikos, P., Pericleous, K., Strusevitch, N., Boitout, F. and Bergheau, J.M. (2003) Evaluation of distortions in laser welded shipbuilding parts using local-global finite element approach. Science and Technology of Welding and Joining, 8 (2). pp. 79-88. ISSN 1362-1718 (Print), 1743-2936 (Online) (doi:10.1179/136217103225010899)

Vince, Ivan and Patel, Mayur (2006) Explosion in fume cupboard damages several laboratories. Loss Prevention Bulletin, 187. pp. 6-8. ISSN 0260-9576

Wang, Junye, Christakis, Nicholas, Patel, Mayur K., Cross, Mark and Leaper, Mark C. (2004) A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions. Numerical Heat Transfer, Part A: Applications, 45 (8). pp. 751-776. ISSN 1040-7782 (Print), 1521-0634 (Online) (doi:10.1080/10407780490424280)

Wang, Z., Jia, F., Galea, E.R., Patel, M.K. and Ewer, J. (2001) Simulating one of the CIB W14 round robin test cases using the SMARTFIRE fire field model. Fire Safety Journal, 36 (7). pp. 661-677. ISSN 0379-7112 (doi:10.1016/S0379-7112(01)00018-2)

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

Wheeler, D., Bailey, C. and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

Wheeler, D., Bailey, C. and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:10.1243/0954405981515563)

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 1: History, present and future of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 153-163. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213585)

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 2: Urban rail transit systems, highway transport and the reform of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 165-174. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213594)

Xue, X., Schmid, F. and Smith, R.A. (2004) A study of modelling approaches for rail vehicle collision behaviour. International Journal of Crashworthiness, 9 (5). pp. 515-525. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2004.0307)

Xue, X., Smith, R. and Schmid, F. (2005) Analysis of crush behaviours of a rail cab car and structural modifications for improved crashworthiness. International Journal of Crashworthiness, 10 (2). pp. 125-136. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2005.0332)

Xue, Xiangdong, Bailey, Chris, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

Xue, Xiangdong, Schmid, F. and Smith, R. (2007) Analysis of the structural characteristics of an intermediate rail vehicle and their effect on vehicle crash performance. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 221 (F3). pp. 339-352. ISSN 0954-4097 (doi:10.1243/09544097JRRT77)

Yao, Jun, Yao, Yufeng, Mason, Peter J. and Patel, Mayur (2009) Numerical simulation of heat transfer in rectangular microchannel. Advances in Applied Mathematics and Mechanics, 1 (2). pp. 231-241. ISSN 2070-0733 (Print), 2075-1354 (Online)

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

Yin, C.Y., Alam, M.O., Chan, Y.C., Bailey, C. and Lu, Hua (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua, Mannan, Samjid, Bailey, Chris and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

Book Section

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Bailey, Christopher (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:10.1109/HDP.2006.1707617)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Burton, D.J., Grandison, Angus, Patel, Mayur, Galea, Edwin R. and Ewer, John (2007) Introducing a hybrid field/zone modelling approach for fire simulation. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1491-1497. ISBN 9780954121693

Chapelle, P., Christakis, N., Abou-Chakra, H., Tuzun, U., Bridle, I., Bradley, M.S.A., Patel, M.K. and Cross, M. (2003) Computational modelling of particle degradation in dilute phase pneumatic conveyors. In: Kumar, Vipin, Gavrilova, Marina L., Tan, Chih Jeng Kenneth and L’Ecuyer, Pierre, (eds.) Computational Science and Its Applications - ICCSA 2003. International Conference Montreal, Canada, May 18–21, 2003 Proceedings. Lecture Notes in Computer Science, Part I (2667). Springer, Berlin Heidelberg, pp. 493-502. ISBN 9783540401551 (doi:10.1007/3-540-44839-X_53)

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C., Bailey, C. and Pericleous, K.A. (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

Dinčov, Duško D., Parrott, Kevin A. and Pericleous, Koulis A. (2002) Coupled 3-D finite difference time domain and finite volume methods for solving microwave heating in porous media. In: Sloot, Peter A., Hoekstra, Alfons G., Tan, C.J. Kenneth and Dongarra, Jack J., (eds.) Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, I (2329). Springer-Verlag, Berlin, Heidelberg, Germany, pp. 813-822. ISBN 9783540435914 (doi:10.1007/3-540-46043-8_82)

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur and Voller, V. (2009) Thermoelectric MHD effects on equiaxed crystal morphology. 6th International Conference on Electromagnetic Processing of Materials, EPM 2009. Forschungszentrum Dresden-Rossendorf, Dresden, Germany. ISBN Forschungszentrum Dresden-Rossendorf

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur K. and Voller, Vaughan R. (2010) Thermoelectric effects on alloy solidification microstructure. In: Cockcroft, Steve L. and Maijer, Daan M., (eds.) Modeling of Casting, Welding, and Advanced Solidification Processes. John Wiley & Sons, Inc. / The Minerals, Metals & Materials Society, Warrendale, PA, USA, pp. 521-528. ISBN 978-0-87339-742-1 (hbk)

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Galea, Edwin R. (2007) Modelling generation and transport of toxic combustion products in enclosure fires using bench-scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1631-1636. ISBN 9780954121693

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

Newcombe, D. R. and Bailey, C. (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:10.1007/3-540-28073-1)

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R. and Patel, Mayur (2007) Predicting toxic species concentrations in a full-scale vitiated fire. Interflam 2007 11th International Fire Science and Engineering Conference. Interflam, 2 . Interscience Communications Ltd, London, pp. 1047-1058. ISBN 9780954121693

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

Xue, Xiangdong, Schmid, F. and Robinson, J. (2006) Finite element modelling approach of crashworthiness of high-speed trains. In: Schulz, Eckhard, (ed.) Passive Safety of Rail Vehicles: Crashworthiness and Interior Design 6th International Symposium. Interdisciplinary Research Network Rail Technology, Berlin, pp. 99-114. ISBN 9783981079777

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

Book

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

Zhao, Jun, Patel, Mayur and Knight, Brian (1996) A self-organising neural network for optimal grid distribution. CMS Paper S, 9 (6). CMS Press, London. ISBN 1899991115 (doi:978-1899991112)

Conference Proceedings

Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

Bailey, C. (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Christakis, N., Chapelle, P. and Patel, M.K. (2006) A computational study of segregation in granular material during heaping. In: 2006 Spring Meeting & 2nd Global Congress on Process Safety. American Institute of Chemical Engineers, New York, USA. ISBN 9780816910755

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

Christakis, Nicholas, Patel, Mayur K., Cross, Mark, Baxter, John, Abou-Chakra, Hadi and Tuzun, Ugur (2002) Predictions of segregation of granular material with the aid of PHYSICA, a 3-D unstructured finite-volume modelling framework. In: International Journal for Numerical Methods in Fluids. Special Issue: ICFD Conference on Numerical Methods for Fluid Dynamics. John Wiley & Sons, Ltd., pp. 281-291. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.319)

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Cross, M., Williams, A., Bailey, C., Taylor, G.A., Pericleous, K. and Croft, T.N. (2000) Towards a comprehensive model of the direct chill casting process. In: Modeling of Casting, Welding and Advanced Solidification Processes IX [Proceedings]. Shaker, Aachen, Germany, pp. 713-720. ISBN 3826572300

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:10.1109/STHERM.2004.1291335)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

Dhinsa, Kulvir K., Bailey, Chris J. and Pericleous, Koulis A. (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (1999) The development and application of group solvers in the SMARTFIRE fire field model. In: Conference Proceedings: Interflam 1999: 8th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 939-950. ISBN 0953231232

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (2000) The development of group solvers in the SMARTFIRE fire field model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 54-57. ISBN 1861661509

Fallah, N.A., Bailey, C. and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

Flynn, David, Lu, Hua, Bailey, Chris and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

Frost, Ian, Patel, Mayur, Galea, Edwin R., Rymacrzyk, P. and Mawhinney, Robert (2001) A semi-automated approach to CAD input into field based fire modelling tools. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1421-1426. ISBN 1899991832

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Grossman, D., Bailey, C., Pericleous, K. and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Hughes, Michael, Pericleous, Koulis and Strusevitch, Nadia (2002) Modelling the fluid dynamics and coupled phenomena in arc weld pools. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 63-81. ISBN 9781902653563

Janes, D., Ewer, J., Galea, E., Patel, M. and Knight, B. (2001) Automatic dynamic control of CFD base fire modelling simulations. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 811-822. ISBN 0953231283

Jia, F., Galea, E.R, and Patel, M.K. (2000) The numerical simulation of compartment fires using an integrated gas and solid phase combustion model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 50-53. ISBN 1861661509

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

Kiani, N.J., Patel, M.K. and Lai, Choi-Hong (2005) Computational modelling of reactive transport in hydrogeological systems. In: Water Resources Management III. WIT Transactions on Ecology and the Environment (80). WIT Press, Southampton, UK, pp. 239-249. ISBN 1845640071

Lee, Yek Bing, Bailey, Christopher, Lu, Hua, Riches, Steve and Bartholomew, Martin (2005) Modelling the Lamination Process for Ruggedised Displays. In: International Symposium on Electronic Materials and Packaging 2005 (EMAP 2005). IEEE, pp. 243-246. ISBN 1424401070 (doi:10.1109/EMAP.2005.1598269)

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Lu, Hua and Bailey, Chris (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Mawhinney, R.N., Galea, E.R. and Patel, M.K. (1996) Fire-sprinkler spray interaction modelling using an Euler-Lagrange approach. In: Conference Proceedings: Interflam '96: Seventh International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 841-845. ISBN 0951632094

McManus, K., Cross, M., Walshaw, C., Johnson, S., Bailey, C., Pericleous, K., Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:10.1016/B978-044482851-4.50009-8)

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan, Ridout, Stephen and Bailey, Chris (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Patel, M.K., Bailey, C., Djambazov, G., Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:10.1109/ESIME.2005.1502852)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Slone, A.K., Cross, M., Pericleous, K.A. and Bailey, C. (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

Stoyanov, S. and Bailey, C. (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Stoyanov, S. and Bailey, C. (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Stoyanov, S., Bailey, C. and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

Stoyanov, Stoyan, Dabek, Alexander and Bailey, Chris (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

Strusevich, Nadezhda V., Pericleous, Koulis and Hughes, Michael (2002) Characterisation of weldpool shapes in the laser welding of thick plates. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 83-92. ISBN 9781902653563

Strusevich, Nadia, Bailey, Chris, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:10.1109/EuroSimE.2013.6529989)

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Taylor, S., Galea, E., Patel, M. and Petridis, M. (1996) SMARTFIRE: an intelligent fire field model. In: Conference Proceedings: Interflam '96: Seventh International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 671-680. ISBN 0951632094

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

Warner, Matt, Parry, John, Bailey, Chris and Lu, Hua (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

Wheeler, D. and Bailey, C. (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

Woon, Fei Ling, Knight, Brian, Petridis, Miltos and Patel, Mayur (2005) CBE-conveyor: a case-based reasoning system to assist engineers in designing conveyor systems. In: Case-Based Reasoning Research and Development: 6th International Conference on Case-Based Reasoning, ICCBR 2005, Chicago, IL, USA, August 23-26, 2005. Proceedings. Lecture Notes in Computer Science (3620). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 640-651. ISBN 9783540281740 (doi:10.1007/11536406_48)

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684363)

Yin, C, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2005) Moisture Effects on the Reliability of Anisotropic Conductive Films. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, pp. 162-167. ISBN 0780390628 (doi:10.1109/ESIME.2005.1502793)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

Yin, Chunyan, Lu, Hua and Bailey, Christopher (2005) Modelling the Performance of Flexible Substrates for Lead-Free Applications. In: Proceedings of 7th Electronic Packaging Technology Conference, 2005. EPTC 2005. IEEE, pp. 342-346. ISBN 0780395786 (doi:10.1109/EPTC.2005.1614418)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and ChaN, Y.C. (2005) Macro-Micro Modelling Analysis for High Density Packaged Flip Chips. In: Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005. IEEE, pp. 1-4. ISBN 0780392922 (doi:10.1109/HDP.2005.251383)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2005) Experimental and Modelling Analysis on the Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film. In: Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. IEEE, pp. 172-177. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452340)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Yan-Cheong (2005) Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications. In: ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference Advances in Electronic Packaging, Parts A, B, and C. ASME, pp. 1293-1298. ISBN 0791842002 (doi:10.1115/IPACK2005-73367)

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

Conference or Conference Paper

Bailey, C. (2005) Numerical Modelling for Electronic Packaging - Future Requirements. In: 2005 6th International Conference on Electronic Packaging Technology (ICEPT), 31 Aug - 02 Sep 2005, Shenzhen, China.

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K., Wang, Junye, Cross, Mark, Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Bridle, Ian and Leaper, Mark C. (2002) Mathematical modelling of the behaviour of granular material in a computational fluid dynamics framework using micro-mechanical models. In: 5th World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

Christakis, Nicholas, Patel, Mayur and Cross, Mark (2001) Predictions of Segregation of Granular Material with the Aid of PHYSICA, a 3-D Unstructured Finite-Volume Modelling Framework. In: ICFD Conference on Numerical Methods for Fluid Dynamics, 26-29 March 2001, Oxford, UK.

Cross, Mark, Stoyanov, Stoyan, Mouchmov, Apostol, Lu, Hua, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris and Pericleous, Koulis (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

Djambazov, George Stefanov, Bailey, Chris, Patel, Mayur K. and Shrimpton, Jennifer (2004) Numerical simulation of vacuum dezincing of lead alloy. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Glinski, G.P., Bailey, C., Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

Jia, F., Patel, M.K. and Galea, E.R. (2004) Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE. In: Fourth Triennial International Fire and Cabin Safety Research Conference, 15–19 Nov 2004, Lisbon, Portugal.

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Powell, Adam, Warren, James and Bailey, Christopher (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

Xia, Y., Häuser, J., Patel, M.K. and Cross, M. (2001) Feature-oriented grid topology design for aerospace configurations. In: Deutscher Luft- und Raumfahrtkongress 2001, 17-20 Sep 2001, Hamburg, Germany.

Monograph

Alessandri, E., Buchlin, J., Cavallini, A., Patel, Mayur and Galea, Edwin R. (1996) On the modelling of the thermal interactions between a spray curtain and an impinging cold gas cloud. Technical Report. University of Greenwich, London. (doi:1899991107)

Alessandri, E., Buchlin, J.M. and Patel, Mayur (1996) Numerical optimisation of water curtain barriers design. Technical Report. University of Greenwich, London. (doi:1899991166)

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

Thesis

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

This list was generated on Thu Oct 13 06:38:21 2016 BST.