Items where School / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

University Structure (5836)
- School of Computing & Mathematical Sciences (992)
  - Centre for Numerical Modelling & Process Analysis (412)
    - Computational Mechanics & Reliability Group (153)

Group by: Date | Creators | Item Type | Uncontrolled Keywords | No Grouping

(CFD) 3D-miniaturised systems 63Sn37Pb solder joints accelerated temperature cycle accelerated testing ACF active matrix liquid crystal display actuator design adhesive adhesive materials adhesives aged iron structures ageing aging algorithms aluminium aluminium wirebonds AMLCD analysis tools analytical techniques and alloys and failure anisotropic conductive film (ACF) applied mathematics articulated trains Asian American Options assembly process technology Au/Ni metallization ball grid array (BGA) ball shear test Bayesian networks Bayesian Networks (BN) binary alloy biofluid behaviour blood plasma separation blood preparation bond strength breakage matrix brittleness bumps case study casting cell-centred CFD CFD analysis CFD fire simulation CFD simulation chip mountdown solder chip-on-board (COB) assembly chip-on-flex (COF) circuits cognition compartment fires composite computational computational fluid dynamics computational fluid dynamics (CFD) computational mechanics computer modelling computer simulation conductive particle conservation constituitive modeling constitutive law contact angle contact resistance contactless continuum model convection oven cooling efficiency coordinate transformation copper copper track designs corrosion fatigue coupled electromagnetic and heat transfer computations coupled simulation coupled solution coupling crack propagation cracking crash dynamics crash simulation crashworthiness creep curves Cu trace cure cure process curing curing process curing processes current crowding current stressing Cutty Sark cyclic thermal-mechanical loading data driven prognostics data-driven prognostics DC-DC DC-DC power converter decision support system degradation tester dendritic growth dendritic-growth deposition design design for manufacture Design for Reliability modelling design methodology Design of Experiment (DoE) method design optimistation design-for-reliability diagnostic techniques die attach dielectric material differential scanning calorimetry (DSC) diffusion digital simulation dilute phase pneumatic conveying distributed manipulation dynamic fluid-structure interaction dynamic load balancing eddy dissipation model (EDM) effluent toxicity electric aircraft electric car electrical configurations electrical connections electrodeposition electromechanical devices electromigration electron bombardment electronic applications electronic components electronic engineering electronic packaging electronic product design electronic products electronics design electronics industry electroplating embedded die embrittlement encapsulant encapsulant curing enclosure fires end-fed probes energy enthalpy equiaxed crystal morphology evacuation models evaluation explosions fabrication failure failure analysis failure based reliability failure mechanisms failure modes failure modes and mechanisms fatigue fatigue life-time FEA ferrous operations finite difference finite element finite element (FE) method finite element analysis finite element analysis (FEA) Finite Element Analysis(FEA) finite element modelling fire field modelling fire modelling fire safety fire simulation flashover Flex-No-Lead project flexible substrates flexible-substrates flip-chip assembly flip-chip packaging flip-chip underfills flow solution fluid dynamics fluid flow fluid mechanics flux focused ion beam Focused Ion Beam (FIB) method foil Fourier transform infra-red spectroscopy (FTIR) Fractional Effective Dose (FDE) fracture fracture mechanics fracture propogation path frequency agile microwave oven bonding system (FAMOBS) glass transition temperature glob top globtop globtop design granular flow granular material granular mixtures health monitoring heaping heat exchangers heat sensitive film heat sinks heat transfer heating heritage structures high current density induced damage high density interconnection technology high density packaging historic hydrogen chloride IGBT module impact individual surface mount components information visualisation integrated software module interaction design interactions interfacial reaction interfacial reaction phenomena intermetallic compound intermetallic compound (IMC) intermetallic compound layer isolation substrate isotropic conductive adhesives (ICAs) jet impingement cooling system joints kinematic-hardening lab-on-a-chip laboratories large-scale engineering processes laser spot weld formation LCD backlighting lead free applications lead free solder lead free solder interconnects lead-free soldering LEDs level set method life prediction life-time LIGA light emitting diode (LED) light emitting diodes light emitting diodes (LEDs) loss modulus low power tests low temperature (T<100 C) low-loss dielectric magnetohydrodynamics manufacturing process manufacturing processes mathematical modelling mathematics Maxwell's equations mechanics megasonic agitation MEMS device metals metals casting MHD Micro-electronic displays micro-electronics manufacture micro-machining process micro-manufactured micro-probe microassembly microchannel biochip separator microchannel systems microchannels microelectronics microelectronics manufacturing microelectronics packaging microfabricated solenoid inductor microfeeder microfluidics microinductor microinductors microsystem design microsystems microvias microwave microwave curing microwave heating microwave processing microwave radiation microwave system microwave systems microwave thawing of frozen food microwaves Miner's linear damage accumulation model-driven prognostics modeling modeling iron modelling modelling biofluids modelling methodology modelling technologies modified EDM moisture momentum moving meshes MPI multi-physics multi-physics modelling multi-scale multiphysics multiphysics analysis multiphysics modelling Nano-Imprint Forming (NIF) nano-techology neural networks non-articulated trains non-linear transient finite element simulations numerical analysis numerical modelling numerical models numerical optimisation numerical schemes numerical simulation numerical simulations Nusselt number NXP off-chip interconnection Oldroyd-B on-chip interconnection one turn inductor open-ended microwave curing system open-ended microwave oven open-ended waveguide cavity oven open-oven OPISA optical interconnects optical performance optimisation optimization optimization of solder optimization tools opto-electronic assembly optoelectronic packaging organic light emitting diodes (OLED) package design parameters packaged modules packaging packaging design packaging technology parallel parallel processing particle swarm optimisation algorithm Pb-free solder PC PHM photonics PHYSICA physics of failure techniques physics-of-failure Physics-of-failure (PoF) model pipe flow pneumatic microactuator PoF polymer polymer cure kinetics models polymer cure models polymer curing polymer encapsulant polymer materials curing polymers potting cure Power Electronic Module (PEM) power electronic modules power electronic modules (PEMs) power electronics power electronics module power electronics modules power electronics modules (PEMs) power module components power supply circuits prediction systems predictive reliability probabilities probability based analytical tools process engineering industry prognostic and health management (PHM)systems prognostics prognostics and health management (PHM) prognostics framework prognostics health management prognostics prediction methodology prototyping radiative fluxes radio frequency (RF) curing rail cab collapse rail safety rail vehicle collision rail vehicle design rectangular microchannel rectangular pipe reduced order modelling (ROM) reduced order models reduced order models (ROM) relative permittivity reliability reliability management reliability prediction reliability prediction techniques remaining useful life (RUL) renewable energy resonant cavity Reynolds number RF-ID tag bonding Richard's equation risk assessment risk mitigation rotation scaling effect scaling laws segregation semi-Lagrange time integration semimetals ship side-by-side dies simulation simulations SiP SiP structure SiP technology solder solder interface strength solder joint solder joint failure solder joints solder-mask defined joints species calculation stacked die staggered mesh staggered mess staggered methods stcked die steelmaking processes storage modulus stress stress and strain distribution structural bonding structural dynamics structural engineering structure substrate delamination survivability Swissair Swissair flight 111 System-in-Package (SiP) structures T-microchannel device testing thawing thermal cycling thermal cycling reliability thermal modeling thermal resistance thermal stresses thermal-mechanical loading thermo-mechanical thermo-mechanical behaviour thermo-mechanical reliability thermo-mechanical reliability analysis thermo-mechanics thermoelectric MHD thermoelectricity thermomigration thermosetting polymer thermosetting polymer materials toxic combustion products toxicity turbulence models uncertainty analysis uncertainty analysisfatigue life-time undercooling unsaturated porous media unstructured unstructured mesh variable frequency microwave (VFM) variable frequency microwave (VFM) heating Variable Frequency Microwave (VFM) system variable frequency microwave technology viscoelastic viscoplastic model visual impairment vitiated fires Wafer Level Packaging (WLP) wafer processing wafer scale level packaging warpage water water curtain barrier water movement waveguide cavity resonator waveguide resonator wetting wetting force wire bond fatigue wire bonds wirebond

Number of items at this level: 153.

(CFD)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science — ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 978-3-540-43591-4 (Print), 978-3-540-46043-5 (Online) ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

3D-miniaturised systems

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

63Sn37Pb solder joints

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

accelerated temperature cycle

Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. In: 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

ACF

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

active matrix liquid crystal display

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. In: 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

actuator design

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print) 1779-6288 (Electronic) (doi:10.1051/ijsmdo/2009003)

adhesive

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2008) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. In: 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

adhesives

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

aged iron structures

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

ageing

aging

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

algorithms

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

aluminium

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. In: 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

AMLCD

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE , pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

analysis tools

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Tim, Xue, Xiangdong, Alam, M.O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

analytical techniques

Xue, Xiangdong, Bailey, Christopher, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

and alloys

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

and failure

anisotropic conductive film (ACF)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. In: Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

applied mathematics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

articulated trains

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. In: Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17 ). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

Asian American Options

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. In: Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:10.1007/3-540-28073-1)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

ball grid array (BGA)

Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

Bayesian networks

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Bayesian Networks (BN)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

binary alloy

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

biofluid behaviour

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

blood plasma separation

blood preparation

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

bond strength

breakage matrix

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

brittleness

bumps

case study

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

casting

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

cell-centred

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

CFD

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

Hughes, Michael, Strussevitch, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2010) Numerical algorithms for modelling electrodeposition: tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

CFD analysis

Kiani, Nageena, Patel, Mayur and Lai, Choi-Hong (2007) CFD analysis of one-dimensional infiltration in vadose zone. Journal of Algorithms & Computational Technology, 1 (4). pp. 477-493. ISSN 1748-3018 (doi:10.1260/174830107783133897)

CFD fire simulation

Jia, F., Patel, M.K., Galea, E.R., Grandison, A. and Ewer, J. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire - part II: fire spread analysis. The Aeronautical Journal of the Royal Aeronautical Society, 110 (1107):3069. pp. 303-314. ISSN 0001-9240

CFD simulation

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

chip-on-board (COB) assembly

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

chip-on-flex (COF)

circuits

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

cognition

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:10.1002/pamm.200700212)

compartment fires

composite

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

computational

computational fluid dynamics

Burton, D.J., Grandison, Angus, Patel, Mayur, Galea, Edwin R. and Ewer, John (2007) Introducing a hybrid field/zone modelling approach for fire simulation. In: Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1491-1497. ISBN 9780954121693

Cross, Mark, Croft, Nick, McBride, Diane, Slone, Avril, Williams, Alison, Bailey, Christopher and Pericleous, Koulis A. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. Aist Transactions - Iron and Steel Technology, 3 (7). pp. 155-163.

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684363)

Yao, Jun, Yao, Yufeng, Mason, Peter J. and Patel, Mayur (2009) Numerical simulation of heat transfer in rectangular microchannel. Advances in Applied Mathematics and Mechanics, 1 (2). pp. 231-241. ISSN 2070-0733 (print) 2075-1354 (electronic)

computational fluid dynamics (CFD)

Dhinsa, K., Bailey, C. and Pericleous, K. (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. Components and Packaging Technologies, IEEE Transactions on , 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

computational mechanics

computer modelling

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. In: 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. In: Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. In: Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. In: 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

computer simulation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

conductive particle

conservation

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

constituitive modeling

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE , pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

constitutive law

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

contact angle

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

contact resistance

contactless

continuum model

Christakis, N, Chapelle, Pierre and Patel, Mayur (2006) Analysis and modeling of heaping behavior of granular mixtures within a computational mechanics framework. Advanced Powder Technology, 17 (4). pp. 383-398. ISSN 0921-8831 (doi:10.1163/156855206777866173)

convection oven

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. In: 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc. , Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

coordinate transformation

copper

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

copper track designs

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. In: IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

corrosion fatigue

coupled electromagnetic and heat transfer computations

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

coupled solution

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

coupling

crack propagation

cracking

crash dynamics

crash simulation

Xue, Xiangdong, Schmid, F. and Smith, R. (2007) Analysis of the structural characteristics of an intermediate rail vehicle and their effect on vehicle crash performance. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit , 221 (F3). pp. 339-352. ISSN 0954-4097 (doi:10.1243/09544097JRRT77)

crashworthiness

Xue, X, Smith, R and Schmid, F (2005) Analysis of crush behaviours of a rail cab car and structural modifications for improved crashworthiness. International Journal of Crashworthiness, 10 (2). pp. 125-136. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2005.0332)

creep curves

Cu trace

cure

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

cure process

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

curing

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

curing process

Tilford, Tim, Ferenets, M., Morris, James E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, Marc P.Y. and Bailey, Christopher (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

current crowding

Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

current stressing

Cutty Sark

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. In: HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

data driven prognostics

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:DOI: 10.3390/mi3010078)

data-driven prognostics

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

DC-DC

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. In: Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

DC-DC power converter

Flynn, David, Lu, Hua, Bailey, Chris and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

decision support system

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. In: Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

degradation tester

dendritic growth

dendritic-growth

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur K. and Voller, Vaughan R. (2010) Thermoelectric effects on alloy solidification microstructure. In: Modeling of Casting, Welding, and Advanced Solidification Processes. John Wiley & Sons, Inc. / The Minerals, Metals & Materials Society, Warrendale, PA, USA, pp. 521-528. ISBN 978-0-87339-742-1 (hbk)

deposition

design

Bailey, Christopher (2006) Design and modeling challenges for high density packaging. In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:10.1109/HDP.2006.1707617)

design for manufacture

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/12390 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Design for Reliability modelling

Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

design methodology

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Design of Experiment (DoE) method

design optimistation

design-for-reliability

diagnostic techniques

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

die attach

dielectric material

differential scanning calorimetry (DSC)

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

diffusion

digital simulation

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

dilute phase pneumatic conveying

distributed manipulation

dynamic fluid-structure interaction

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

dynamic load balancing

eddy dissipation model (EDM)

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R. and Patel, Mayur (2007) Predicting toxic species concentrations in a full-scale vitiated fire. In: Interflam 2007 11th International Fire Science and Engineering Conference. Interflam, 2 . Interscience Communications Ltd, London, pp. 1047-1058. ISBN 9780954121693

effluent toxicity

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. In: Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

electric aircraft

Bailey, Christopher, Lu, Hua and Newcombe, D.R. (2007) Rapid solutions for application specific IGBT module design. In: International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electric car

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. In: ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

electrical connections

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

electrodeposition

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. In: 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

electromechanical devices

electromigration

electron bombardment

electronic applications

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

electronic engineering

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronic packaging

electronic product design

electronic products

Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

electronics design

electronics industry

electroplating

embedded die

Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146

embrittlement

encapsulant

encapsulant curing

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

enclosure fires

Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Galea, Edwin R. (2007) Modelling generation and transport of toxic combustion products in enclosure fires using bench-scale test data. In: Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1631-1636. ISBN 9780954121693

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. In: 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

energy

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2007) Numerical simulation of incompressible flow problems using an unstructured staggered mesh method. Journal of Algorithms and Computational Technology, 1 (3). pp. 273-302. ISSN 1748-3018 (doi:10.1260/174830107782424066)

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

enthalpy

equiaxed crystal morphology

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur and Voller, V. (2009) Thermoelectric MHD effects on equiaxed crystal morphology. In: 6th International Conference on Electromagnetic Processing of Materials, EPM 2009. Forschungszentrum Dresden-Rossendorf, Dresden, Germany. ISBN Forschungszentrum Dresden-Rossendorf

evacuation models

evaluation

explosions

Vince, Ivan and Patel, Mayur (2006) Explosion in fume cupboard damages several laboratories. Loss Prevention Bulletin, 187. pp. 6-8. ISSN 0260-9576

fabrication

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

failure

failure analysis

failure based reliability

failure mechanisms

failure modes

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

fatigue

fatigue life-time

FEA

ferrous operations

finite difference

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. In: EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

finite element (FE) method

finite element analysis

finite element analysis (FEA)

Finite Element Analysis(FEA)

finite element modelling

fire field modelling

fire modelling

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2006) A suggested procedure for benchmarking fire field models. International Journal on Engineering Performance-Based Fire Codes, 8 (4). pp. 132-144. ISSN 1561-9559

fire safety

Galea, E. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire – Part 1: Prediction of the pre-fire air flow within the cockpit and surrounding areas. The Aeronautical Journal, 110 (1103). ISSN 0001-9240

fire simulation

flashover

Flex-No-Lead project

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flexible substrates

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. In: Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

flexible-substrates

flip-chip assembly

flip-chip packaging

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

flip-chip underfills

flow solution

fluid dynamics

fluid flow

fluid mechanics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

flux

focused ion beam

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan, Ridout, Stephen and Bailey, Chris (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Focused Ion Beam (FIB) method

foil

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

Fourier transform infra-red spectroscopy (FTIR)

Fractional Effective Dose (FDE)

fracture

fracture mechanics

Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

fracture propogation path

frequency agile microwave oven bonding system (FAMOBS)

glass transition temperature

glob top

globtop

globtop design

granular flow

granular material

granular mixtures

health monitoring

heaping

heat exchangers

heat sensitive film

heat sinks

heat transfer

Alessandri, E., Mawhinney, R.N., Patel, Mayur and Galea, Edwin R. (1996) Revisiting the carrier-phase source-term formulation in mixed Lagrangian-Eulerian particle models. Numerical Heat Transfer, Part B: Fundamentals, 30 (1). pp. 111-116. ISSN 1521-0626 (electronic) 1040-7790 (paper) (doi:10.1080/10407799608915074)

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

heating

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

heritage structures

high current density induced damage

high density interconnection technology

high density packaging

historic

hydrogen chloride

IGBT module

impact

individual surface mount components

information visualisation

integrated software module

interaction design

interactions

interfacial reaction

interfacial reaction phenomena

intermetallic compound

intermetallic compound (IMC)

intermetallic compound layer

isolation substrate

isotropic conductive adhesives (ICAs)

jet impingement cooling system

joints

kinematic-hardening

lab-on-a-chip

laboratories

Vince, Ivan and Patel, Mayur (2006) Explosion in fume cupboard damages several laboratories. Loss Prevention Bulletin, 187. pp. 6-8. ISSN 0260-9576

large-scale engineering processes

laser spot weld formation

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

LCD backlighting

lead free applications

lead free solder

lead free solder interconnects

lead-free soldering

LEDs

level set method

life prediction

life-time

LIGA

light emitting diode (LED)

light emitting diodes

light emitting diodes (LEDs)

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

loss modulus

low power tests

low temperature (T<100 C)

low-loss dielectric

magnetohydrodynamics

manufacturing process

manufacturing processes

mathematical modelling

mathematics

Bailey, Christopher, Clapham, S., Cross, Mark, Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (Issue Supplement S4). pp. 97-100. ISSN ISSN: 0044-2267 (print), 1521-4001 (online) (doi:10.1002/zamm.19960761408)

Maxwell's equations

mechanics

megasonic agitation

MEMS device

metals

metals casting

Bailey, Christopher, Lyster, C., Cross, Mark, Fryer, Yvonne and Pericleous, Koulis A. (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:10.1098/rspa.1996.0024)

MHD

Micro-electronic displays

micro-electronics manufacture

micro-machining process

micro-manufactured

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. In: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

micro-probe

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

microassembly

microchannel biochip separator

microchannel systems

microchannels

microelectronics

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

microelectronics manufacturing

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

microfabricated solenoid inductor

microfeeder

microfluidics

microinductor

microinductors

microsystem design

microsystems

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

microvias

microwave

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

microwave curing

microwave heating

microwave processing

microwave radiation

microwave system

microwave systems

microwave thawing of frozen food

microwaves

Miner's linear damage accumulation

model-driven prognostics

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

modeling

modeling iron

modelling

modelling biofluids

modelling methodology

modelling technologies

modified EDM

moisture

momentum

moving meshes

MPI

multi-physics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

multi-physics modelling

multi-scale

multiphysics

multiphysics analysis

multiphysics modelling

Nano-Imprint Forming (NIF)

nano-techology

neural networks

Zhao, Jun, Patel, Mayur and Knight, Brian (1996) A self-organising neural network for optimal grid distribution. CMS Paper S, 9 (6). CMS Press, London. ISBN 1899991115 (doi:978-1899991112)

non-articulated trains

non-linear transient finite element simulations

Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

numerical analysis

numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

numerical models

numerical optimisation

Alessandri, E., Buchlin, J.M. and Patel, Mayur (1996) Numerical optimisation of water curtain barriers design. Technical Report. University of Greenwich, London. (doi:1899991166)

numerical schemes

numerical simulation

numerical simulations

Nusselt number

NXP

off-chip interconnection

Oldroyd-B

on-chip interconnection

one turn inductor

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

open-ended microwave oven

open-ended waveguide cavity oven

open-oven

OPISA

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

optical performance

optimisation

optimization

optimization of solder

optimization tools

opto-electronic assembly

optoelectronic packaging

organic light emitting diodes (OLED)

package design parameters

packaged modules

packaging

packaging design

packaging technology

Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

parallel

parallel processing

particle swarm optimisation algorithm

Pb-free solder

PC

PHM

photonics

PHYSICA

physics of failure techniques

physics-of-failure

Physics-of-failure (PoF) model

pipe flow

pneumatic microactuator

PoF

polymer

polymer cure kinetics models

polymer cure models

polymer curing

polymer encapsulant

polymer materials curing

polymers

potting cure

Power Electronic Module (PEM)

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. In: CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

power electronic modules

power electronic modules (PEMs)

power electronics

power electronics module

power electronics modules

power electronics modules (PEMs)

power module components

power supply circuits

prediction systems

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

predictive reliability

probabilities

probability based analytical tools

process engineering industry

prognostic and health management (PHM)systems

prognostics

prognostics and health management (PHM)

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

prognostics framework

prognostics health management

prognostics prediction methodology

prototyping

radiative fluxes

radio frequency (RF) curing

rail cab collapse

rail safety

Xue, Xiangdong, Schmid, F. and Robinson, J. (2006) Finite element modelling approach of crashworthiness of high-speed trains. In: Passive Safety of Rail Vehicles: Crashworthiness and Interior Design 6th International Symposium. Interdisciplinary Research Network Rail Technology, Berlin, pp. 99-114. ISBN 9783981079777

rail vehicle collision

rail vehicle design

rectangular microchannel

rectangular pipe

reduced order modelling (ROM)

reduced order models

reduced order models (ROM)

Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

relative permittivity

reliability

reliability management

reliability prediction

reliability prediction techniques

remaining useful life (RUL)

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

renewable energy

resonant cavity

Reynolds number

RF-ID tag bonding

Richard's equation

risk assessment

risk mitigation

rotation

scaling effect

scaling laws

segregation

semi-Lagrange time integration

semimetals

ship

side-by-side dies

simulation

simulations

SiP

SiP structure

SiP technology

solder

solder interface strength

solder joint

solder joint failure

solder joints

solder-mask defined joints

species calculation

stacked die

staggered mesh

staggered mess

staggered methods

stcked die

steelmaking processes

storage modulus

stress

stress and strain distribution

structural bonding

structural dynamics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

structural engineering

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

structure

substrate delamination

survivability

Swissair

Swissair flight 111

System-in-Package (SiP) structures

T-microchannel device

testing

thawing

thermal cycling

thermal cycling reliability

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)

thermal modeling

thermal resistance

thermal stresses

thermal-mechanical loading

thermo-mechanical

thermo-mechanical behaviour

thermo-mechanical reliability

thermo-mechanical reliability analysis

thermo-mechanics

thermoelectric MHD

thermoelectricity

thermomigration

thermosetting polymer

thermosetting polymer materials

toxic combustion products

toxicity

turbulence models

uncertainty analysis

uncertainty analysisfatigue life-time

undercooling

unsaturated porous media

unstructured

unstructured mesh

variable frequency microwave (VFM)

variable frequency microwave (VFM) heating

Variable Frequency Microwave (VFM) system

variable frequency microwave technology

viscoelastic

viscoplastic model

visual impairment

vitiated fires

Wafer Level Packaging (WLP)

wafer processing

wafer scale level packaging

warpage

water

Alessandri, E., Buchlin, J.M. and Patel, Mayur (1996) Numerical optimisation of water curtain barriers design. Technical Report. University of Greenwich, London. (doi:1899991166)

water curtain barrier

Alessandri, E., Buchlin, J., Cavallini, A., Patel, Mayur and Galea, Edwin R. (1996) On the modelling of the thermal interactions between a spray curtain and an impinging cold gas cloud. Technical Report. University of Greenwich, London. (doi:1899991107)

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Items where School / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

(CFD)

3D-miniaturised systems

63Sn37Pb solder joints

accelerated temperature cycle

accelerated testing

ACF

active matrix liquid crystal display

actuator design

adhesive

adhesive materials

adhesives

aged iron structures

ageing

aging

algorithms

aluminium

aluminium wirebonds

AMLCD

analysis tools

analytical techniques

and alloys

and failure

anisotropic conductive film (ACF)

applied mathematics

articulated trains

Asian American Options

assembly process technology

Au/Ni metallization

ball grid array (BGA)

ball shear test

Bayesian networks

Bayesian Networks (BN)

binary alloy

biofluid behaviour

blood plasma separation

blood preparation

bond strength

breakage matrix

brittleness

bumps

case study

casting

cell-centred

CFD

CFD analysis

CFD fire simulation

CFD simulation

chip mountdown solder

chip-on-board (COB) assembly

chip-on-flex (COF)

circuits

cognition

compartment fires

composite

computational

computational fluid dynamics

computational fluid dynamics (CFD)

computational mechanics

computer modelling

computer simulation

conductive particle

conservation

constituitive modeling

constitutive law

contact angle

contact resistance

contactless

continuum model

convection oven

cooling efficiency

coordinate transformation

copper

copper track designs