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Items where Faculty / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

Items where Faculty / Department / Research Groups is "School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group"

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(ACF) (CFD (CFD) (DFSI) (FE) (FIREDASS) (HSD) (PGM) (QFP) 3D flow simulation 3D-miniaturised systems 63Sn37Pb solder joints accelerated temperature cycle accelerated testing ACF acoustic streaming active matrix liquid crystal display actuator design adaptive time\-stepping adhesion adhesive adhesive bonding adhesive flows adhesive materials adhesives aerospace aged iron structures ageing ageing (materials) aging aircraft evacuation aircraft safety algorithms alloying additions aluminium aluminium wirebonds American option pricing AMLCD Analysis analysis tools analytical techniques and alloys and failure anisotropic conductive film anisotropic conductive film (ACF) anisotropic conductive films anisotropic magnetoresistance anisotropic media applied mathematics articulated trains artificial intelligence artificial intelligence (incl. robotics) Asian American Options aspect ratio assembling assembly assembly process technology Au/Ni metallization backdraft ball grid array ball grid array (BGA) ball grid arrays ball shear test Bayesian networks Bayesian Networks (BN) bend orientation bend wear BGA binary alloy biofluid behaviour Black-Scholes equation blood flow blood plasma separation blood preparation bond strength breakage matrices breakage matrix bridge circuits brittleness bulk solids bulk synchronous parallel (BSP) computation model bumps business information systems Cabs (Vehicle compartments) CAD caking case based engineering case study case-based reasoning casting casting process catalytic converters CBR cell-centred centrifugal erosion tester ceramic packaging CFD CFD pipe bends CFD analysis CFD fire simulation CFD simulation CFD software CFDS-FLOW3D characterisation charring materials China chip mountdown solder chip scale packaging chip-on-board (COB) assembly chip-on-board packaging chip-on-flex (COF) circuit optimisation circuit reliability circuit simulation circuits Coffin-Manson cognition compartment fires complex geometries composite compuational fluid dynamics (CFD) computater modelling computational computational analysis software computational complexity computational fluid dynamics computational fluid dynamics (CFD) computational linguistics computational mechanics computational modeling computational modelling computational solid mechanics computational study computer aided analysis computer modelling Computer models computer simulation condensed matter: electrical condensed matter: structural conducting materials conducting polymers conductive adhesive conductive adhesives conductive particle conservation constituitive modeling constitutive law constraints contact angle contact resistance contactless continuum mechanics continuum model continuum modelling convection oven cooling cooling efficiency cooling electronics packaging coordinate transformation copper copper alloys copper track designs core flow corrosion fatigue coupled electromagnetic and heat transfer computations coupled heat and moisture transfer coupled simulation coupled solution coupled solvers coupling crack detection crack propagation cracking crash dynamics crash simulation crashworthiness creep creep curves crystal orientation crystal structure crystal symmetry crystals Cu column Cu columns Cu trace cure cure process curing curing process curing processes current crowding current density current stressing Cutty Sark CV² cyclic thermal-mechanical loading data driven prognostics data-driven prognostics DC magnetic pump DC-DC DC-DC power converter decision support system defects Deformable objects degradation degradation tester delamination demagnetization dendritic growth dendritic-growth dense suspension density dependence deposition design design for manufacture Design for Reliability modelling design methodology Design of Experiment (DoE) method design of experiments design optimistation design-for-reliability diagnostic techniques die attach dielectric material differential scanning calorimetry (DSC) diffusion digital simulation dilute phase dilute phase pneumatic conveying dilute-phase pneumatic conveying direct chill casting process discrete element disordered solids dispersion relations dissolving distributed manipulation domain walls ductility dynamic fluid-structure interaction dynamic load balancing dynamic solid mechanics eddy dissipation model (EDM) edge elements effect of reflow process effluent toxicity electric aircraft electric car electrical configurations electrical connections electro-migration electrodeposition electrodeposition of copper electroless Ni–P layer electrolytes electromagnetic simulation software electromagnetic compatibility electromagnetic field electromagnetic finite codes electromagnetic pump/brake electromagnetic radiation electromechanical devices electromigration electron bombardment electronic applications electronic components electronic design automation electronic engineering electronic engineering computing electronic packages electronic packaging electronic product assembly electronic product design electronic production design electronic products electronics design electronics industry electroplating electrostatic embedded die embrittlement empirical model encapsulant encapsulant curing enclosure fires end-fed probes energy engineering computing enthalpy environmental conditions equiaxed crystal morphology erosion Euler-Lagrange approach Eulerian European Synchrotron Radiation Facility (ESRF) eutectic alloys evacuation models evaluation event history analysis expert system explosions fabrication failure failure analysis failure based reliability failure mechanisms failure modes failure modes and mechanisms fatigue fatigue life-time fatigue of materials FEA ferrous operations field model field modelling field models filled polymers films (states of matter) fine-pitch technology finite difference finite difference method finite difference time-domain analysis finite element finite element (FE) method finite element analysis finite element analysis (FEA) Finite Element Analysis(FEA) finite element method finite element methods finite element modeling finite element modelling finite volume finite volume method finite volume methods finite volume unstructured mesh finite volumes finite-difference schemes finite-volume code fire compartments FIRE Detection and Suppression Simulation fire field model fire field modelling fire modelling fire safety fire simulation fire simulation software fire test fire-field modelling flashover Flex-No-Lead project flexible substrates flexible-substrates flight simulation flip chip flip chip devices flip chip on flex flip chip packaging flip chip technology flip-chip flip-chip assembly flip-chip devices flip-chip devices printed circuit manufacture flip-chip packaging flip-chip underfills flipchip flow flow behaviour flow simulation flow solution fluctuations fluid dynamics fluid flow fluid mechanics fluid structure interaction fluids engineering descriptors fluid–structure interaction flux flux symmetries focused ion beam Focused Ion Beam (FIB) method foil forced convection Fourier transform infra-red spectroscopy (FTIR) Fractals Fractional Effective Dose (FDE) fracture fracture mechanics fracture propogation path fractures frequency agile microwave oven bonding system (FAMOBS) gas flow gaseous combustion model geometric conservation law geometric mesh partitioning methods geometrically nonlinear geometry glass transition temperature glob top globtop globtop design granular flow granular flows granular material granular materials granular mixtures health monitoring heaping heat conduction heat dissipation heat exchangers heat sensitive film heat sinks heat transfer heating heritage structures heterogeneity high aspect ratio microvia high current density induced damage high density interconnection technology high density packaging high performance high performance computing High Performance Primitive Collections highway historic history Hopper configuration host–parasitoid interactions Hot Solder Dip hot solder dip process HPPC hydrogen chloride IGBT module impact impact degradation individual surface mount components industrial plants information visualisation insulated gate bipolar transistors integrated circuit integrated circuit interconnections integrated circuit metallisation integrated circuit modelling integrated circuit packaging integrated circuit reliability integrated optoelectronics integrated software module integration interaction design interactions interconnections interfaces (computer) interfaces (materials) interfacial reaction interfacial reaction phenomena intermetallic compound intermetallic compound (IMC) intermetallic compound layer intermetallic compounds intermetallic compounds (IMCs) interpolation iron iron films isolation substrate isothermal fatigue test isotropic conductive adhesives (ICAs) jet impingement cooling system joints Joule heating kinematic-hardening lab-on-a-chip laboratories Lagrangian Large large-scale engineering processes lase welding laser laser beam welding laser spot weld formation LCD backlighting lead lead free applications lead free solder lead free solder interconnects lead-free solder lead-free soldering lead-free solders LED displays LEDs level set method life cycle costing life prediction Life sized life testing life-time lifetime prediction LIGA light emitting diode (LED) light emitting diodes light emitting diodes (LEDs) Local Area Networks Lorentz force loss modulus low power tests low temperature (T<100 C) low-loss dielectric magnetic and optical magnetic domains magnetization magneto-hydrodynamics magnetoelectric effects magnetohydrodynamics manufacturing process manufacturing processes Marangoni flow maritime safety materials processing materials properties materials science mathematical logic and formal languages mathematical modelling mathematical models mathematical techniques mathematics Maxwell equations Maxwell's equations mechanical & thermal mechanical testing printed circuit testing mechanics megasonic agitation melting melting processes MEMS device mesh generation mesh sensitivity metal migration metal-hydrogen systems metallic films metals metals casting metal–hydrogen systems metro MHD MHD flow Micro-electronic displays micro-electronics manufacture micro-machining process micro-manufactured micro-mechanical parametrisations micro-mechanical parametrizations micro-particle imaging velocimetry (micro-PIV) micro-physical parametrizations micro-probe microassembling microassembly microchannel biochip separator microchannel systems microchannels microelectronic processing microelectronics microelectronics manufacturing microelectronics packaging microfabricated solenoid inductor microfeeder microfluidics microinductor microinductors micromagnetic simulation micromagnetism micromechanical parametrisations microsystem design microsystems microvia fabrication microvias microwave microwave cooking microwave cure microwave curing microwave heating microwave processing microwave radiation microwave system microwave systems microwave thawing of frozen food microwaves Miner's linear damage accumulation model implementation model-driven prognostics modeling modeling iron modelling modelling polymerisation modelling biofluids modelling methodology modelling of rail accident modelling technologies modified EDM modules moisture moisture absorption molecular dynamics momentum Monte Carlo calculations Monte Carlo study moving meshes MPI multi-physics Multi-physics modeling multi-physics modelling multi-physics processes multi-scale multi-scale computational simulations multi-scale simulations multigrid multiphysics multiphysics analysis multiphysics modeling multiphysics modelling N-body N-body potential Nano-Imprint Forming (NIF) nano-techology nanopatterning natural convection neural networks neutron quasi-elastic scattering newmark algorithm Newton Raphson nitrogen no-flow underfill materials non-articulated trains non-linear non-linear transient finite element simulations non-Newtonian nonlinear volatility 1. INTRODUCTION nuclear magnetic relaxation nucleation numerical analysis numerical modeling numerical modelling numerical models Numerical Optimilation numerical optimisation numerical optimization material properties numerical schemes numerical simulation numerical simulations Nusselt number NXP off-chip interconnection office-based PCs Oldroyd-B on-chip interconnection one turn inductor open architecture open-ended microwave curing system open-ended microwave oven open-ended waveguide cavity oven open-oven OPISA optical backplanes optical backplanes optical planar waveguides optical couplers optical fiber optical interconnects optical performance optical waveguides photodiodes optimisation optimization optimization of solder optimization tools option pricing opto-electronic assembly optoelectronic packages optoelectronic packaging organic light emitting diodes organic light emitting diodes (OLED) oscillatory flow behaviour oxygen Pacala–Hassell model package design parameters packaged modules packaging packaging design packaging technology parallel parallel algorithms parallel architectures parallel computer systems parallel computing parallel processing Parallel processing systems parallel processing techniques parameterisation particle concentration particle degradation particle swarm optimisation algorithm patch dynamics Pb-free solder PC performance PHM photonics PHYSICA physics of failure (PoF) physics of failure techniques physics-of-failure Physics-of-failure (PoF) model pipe flow plastic deformation plates platinum group metals platinum-group metals pneumatic conveyor pneumatic conveyors pneumatic microactuator PoF polymer polymer cure kinetics models polymer cure models polymer curing polymer encapsulant polymer films polymer materials curing polymeric channels polymers porous materials porous media porous media heat transfer portability post-flashover potting cure power bipolar transistors Power Electronic Module (PEM) power electronic modules power electronic modules (PEMs) power electronics power electronics module power electronics modules power electronics modules (PEMs) power integrated circuits power module components power modules power supply circuits predictability prediction systems predictive reliability printed circuit board reflow printed circuit boards printed circuit design printed circuit manufacture printed circuits printing probabilities probability based analytical tools process engineering industry product functionality prognostic and health management (PHM)systems prognostics prognostics and health management (PHM) prognostics framework prognostics health management prognostics prediction methodology prototyping puncture point pyrolysis pyrolysis model pyrolysis modelling pyrometallurgical process Quad Flat Package quality control radiative fluxes radio frequency (RF) curing rail cab collapse rail safety rail vehicle collision rail vehicle design Railroad cars Railroad crashes Railroad safety railways recirculation vortex recirculation vortices recovery mechanism rectangular microchannel rectangular pipe reduced order modelling (ROM) reduced order models reduced order models (ROM) reflow reflow soldering relative permittivity reliability reliability management reliability prediction reliability prediction techniques reliability study reliable electronic packaging remaining useful life (RUL) renewable energy resistors resonant cavity Response Surface Reynolds number RF-ID tag bonding rheology Richard's equation Rigid ripple structures risk assessment risk mitigation ROMARA software rotation scaling effect scaling laws scanning acoustic microscopes segregation semi-Lagrange time integration semiconductor device semiconductor device modeling semiconductor device packaging semiconductor device reliability semiconductor lasers semiconductor process modelling semimetals sensitivity analysis shear turbulence shielding effect ship shipbuilding shunt side-by-side dies silver alloys simulation simulation of fracture simulations SiP SiP structure SiP technology SMARTFIRE Sn-2.8Ag-0.5Cu-1.0Bi software solder solder alloy solder interface strength solder joint solder joint failure solder joints solder paste solder pastes solder-mask defined joints soldered joints soldering solders solders thermal stress cracking solid fuel combustion solid mechanics solidification species calculation sprinkler systems stable equilibrium structures stacked die staggered mesh staggered mess staggered methods steelmaking processes stencil printing stencils stochastic volatility storage modulus strain strain measurement strength of materials stress stress analysis stress and strain distribution strike\-price related transformation structural bonding structural dynamics structural engineering structure substrate delamination surface surface anisotropy surface emitting lasers surface mount technology surface tension survivability Swissair Swissair flight 111 synchrotron System-in-Package (SiP) structures T-microchannel device temperature temperature distribution tension testing tetrahedral meshes thawing thermal thermal cycling thermal analysis thermal cycles thermal cycling reliability thermal expansion thermal management thermal management (packaging) thermal modeling thermal radiation modelling thermal resistance thermal stress thermal stress cracking thermal stresses thermal-mechanical loading thermo-mechanical thermo-mechanical behaviour thermo-mechanical loading thermo-mechanical reliability analysis thermo-mechanics thermoelectric MHD thermoelectricity thermomigration thermosetting polymer thermosetting polymer materials thick section welding tin alloys tin whiskers toxic combustion products toxicity transient structural dynamics transitional flow transport turbulence turbulence modelling turbulence models turbulent fluid flow two-phase flow uncertainty analysis undercooling underfill unsaturated porous media unstructured unstructured mesh urban rail validation variable frequency microwave (VFM) variable frequency microwave (VFM) heating Variable Frequency Microwave (VFM) system variable frequency microwave technology Vehicle dynamics verification vertex-based vias virtual manufacturing virtual prototyping viscoelastic viscoplastic model viscoplasticity visual impairment vitiated fires voids evolution Wafer Level Packaging (WLP) wafer processing wafer scale level packaging warpage water water curtain barrier water misting systems water movement wave soldering waveguide cavity resonator waveguide resonator welding arc welding distortion welding phenomena weldpool dynamics Wettability wetting wetting force wire bond fatigue wire bonds wirebond X ray microscopes X-ray diffraction (XRD) zinc
Number of items at this level: 1561.

(ACF)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

(CFD

Ewer, J., Galea, E.R., Patel, M.K., Taylor, S., Knight, B. and Petridis, M. (1999) SMARTFIRE: an intelligent CFD based fire model. Journal of Fire Protection Engineering, 10 (1). pp. 13-27. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159901000102)

(CFD)

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

Jia, F., Patel, M.K. and Galea, E.R. (2004) Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE. In: Fourth Triennial International Fire and Cabin Safety Research Conference, 15–19 Nov 2004, Lisbon, Portugal.

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

(DFSI)

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

(FE)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

(FIREDASS)

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

(HSD)

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

(PGM)

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

(QFP)

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

3D flow simulation

Xia, Y., Häuser, J., Patel, M.K. and Cross, M. (2001) Feature-oriented grid topology design for aerospace configurations. In: Deutscher Luft- und Raumfahrtkongress 2001, 17-20 Sep 2001, Hamburg, Germany.

3D-miniaturised systems

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

63Sn37Pb solder joints

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

accelerated temperature cycle

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

ACF

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

acoustic streaming

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

active matrix liquid crystal display

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

actuator design

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

adaptive time\-stepping

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:10.1080/135048699334528)

adhesion

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

adhesive

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

adhesive bonding

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

adhesive flows

Glinski, G.P., Bailey, C., Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

adhesives

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

aerospace

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

aged iron structures

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

ageing

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

ageing (materials)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

aging

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

aircraft evacuation

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

aircraft safety

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

algorithms

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

alloying additions

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

aluminium

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

American option pricing

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:10.1080/135048699334528)

AMLCD

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Analysis

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

analysis tools

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

analytical techniques

Xue, Xiangdong, Bailey, Chris, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

and alloys

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

and failure

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

anisotropic conductive film

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

anisotropic conductive film (ACF)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

Yin, C.Y., Alam, M.O., Chan, Y.C., Bailey, C. and Lu, Hua (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

anisotropic conductive films

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

anisotropic magnetoresistance

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

anisotropic media

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

applied mathematics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

articulated trains

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

artificial intelligence

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

artificial intelligence (incl. robotics)

Woon, Fei Ling, Knight, Brian, Petridis, Miltos and Patel, Mayur (2005) CBE-conveyor: a case-based reasoning system to assist engineers in designing conveyor systems. In: Case-Based Reasoning Research and Development: 6th International Conference on Case-Based Reasoning, ICCBR 2005, Chicago, IL, USA, August 23-26, 2005. Proceedings. Lecture Notes in Computer Science (3620). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 640-651. ISBN 9783540281740 (doi:10.1007/11536406_48)

Asian American Options

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:10.1007/3-540-28073-1)

aspect ratio

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

assembling

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

assembly

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

backdraft

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

ball grid array

Stoyanov, Stoyan, Dabek, Alexander and Bailey, Chris (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

ball grid array (BGA)

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

ball grid arrays

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

ball shear test

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Bayesian networks

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Bayesian Networks (BN)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

bend orientation

Deng, T., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors. Wear, 258 (1-4). pp. 426-433. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.010)

bend wear

Deng, T., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of particle concentration on erosion rate of mild steel bends in a pneumatic conveyor. Wear, 258 (1-4). pp. 480-487. ISSN 0043-1648 (doi:10.1016/j.wear.2004.08.001)

Deng, T., Li, J., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Comparison between weight loss of bends in a pneumatic conveyor and erosion rate obtained in a centrifugal erosion tester for the same materials. Wear, 258 (1-4). pp. 402-411. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.012)

Deng, T., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors. Wear, 258 (1-4). pp. 426-433. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.010)

BGA

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

binary alloy

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

biofluid behaviour

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

Black-Scholes equation

Lai, C.-H., Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:10.1016/j.camwa.2004.03.014)

blood flow

Grossman, D., Bailey, C., Pericleous, K. and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

blood plasma separation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

blood preparation

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

bond strength

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

breakage matrices

Chapelle, Pierre, Christakis, Nicholas, Abou-Chakra, Hadi, Bridle, Ian, Bradley, M.S.A., Patel, Mayur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute-phase pneumatic conveying: modeling of dilute-phase pneumatic conveying. Advanced Powder Technology, 15 (1). pp. 31-49. ISSN 0921-8831 (Print), 1568-5527 (Online) (doi:10.1163/15685520460740052)

breakage matrix

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

bridge circuits

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

brittleness

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

bulk solids

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

bulk synchronous parallel (BSP) computation model

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

bumps

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

business information systems

Woon, Fei Ling, Knight, Brian, Petridis, Miltos and Patel, Mayur (2005) CBE-conveyor: a case-based reasoning system to assist engineers in designing conveyor systems. In: Case-Based Reasoning Research and Development: 6th International Conference on Case-Based Reasoning, ICCBR 2005, Chicago, IL, USA, August 23-26, 2005. Proceedings. Lecture Notes in Computer Science (3620). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 640-651. ISBN 9783540281740 (doi:10.1007/11536406_48)

Cabs (Vehicle compartments)

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

CAD

Frost, Ian, Patel, Mayur, Galea, Edwin R., Rymacrzyk, P. and Mawhinney, Robert (2001) A semi-automated approach to CAD input into field based fire modelling tools. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1421-1426. ISBN 1899991832

Xia, Y., Häuser, J., Patel, M.K. and Cross, M. (2001) Feature-oriented grid topology design for aerospace configurations. In: Deutscher Luft- und Raumfahrtkongress 2001, 17-20 Sep 2001, Hamburg, Germany.

caking

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

case based engineering

Woon, Fei Ling, Knight, Brian, Petridis, Miltos and Patel, Mayur (2005) CBE-conveyor: a case-based reasoning system to assist engineers in designing conveyor systems. In: Case-Based Reasoning Research and Development: 6th International Conference on Case-Based Reasoning, ICCBR 2005, Chicago, IL, USA, August 23-26, 2005. Proceedings. Lecture Notes in Computer Science (3620). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 640-651. ISBN 9783540281740 (doi:10.1007/11536406_48)

case study

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

case-based reasoning

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

casting

Bailey, C., Bounds, S., Cross, M., Moran, G, Pericleous, K. and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

casting process

Chow, P., Bailey, C., Cross, M. and Pericleous, K.A. (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Cross, M., Williams, A., Bailey, C., Taylor, G.A., Pericleous, K. and Croft, T.N. (2000) Towards a comprehensive model of the direct chill casting process. In: Modeling of Casting, Welding and Advanced Solidification Processes IX [Proceedings]. Shaker, Aachen, Germany, pp. 713-720. ISBN 3826572300

catalytic converters

Benson, M., Bennett, C.R., Harry, J.E., Patel, M.K. and Cross, M. (2000) The recovery mechanism of platinum group metals from catalytic converters in spent automotive exhaust systems. Resources, Conservation and Recycling, 31 (1). pp. 1-7. ISSN 0921-3449 (doi:10.1016/S0921-3449(00)00062-8)

CBR

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

cell-centred

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

centrifugal erosion tester

Deng, T., Li, J., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Comparison between weight loss of bends in a pneumatic conveyor and erosion rate obtained in a centrifugal erosion tester for the same materials. Wear, 258 (1-4). pp. 402-411. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.012)

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris and Lu, Hua (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

CFD

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:10.1109/STHERM.2004.1291335)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

Dhinsa, Kulvir K., Bailey, Chris J. and Pericleous, Koulis A. (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Fallah, N.A., Bailey, C. and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Janes, D., Ewer, J., Galea, E., Patel, M. and Knight, B. (2001) Automatic dynamic control of CFD base fire modelling simulations. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 811-822. ISBN 0953231283

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

Jia, Fuchen, Patel, Mayur and Galea, Edwin (2003) Flight simulation. Fire Prevention & Fire Engineers Journal, 2003 (Sept.). pp. 27-29. ISSN 1478-3576

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Patel, M.K., Bailey, C., Djambazov, G., Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

Pericleous, Kyriacos A and Dempsey, Stephen (1995) Turbulent flow simulation using a fractal based LES model. Journal of Fluid Engineering, 208. pp. 61-66.

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Wang, Z., Jia, F., Galea, E.R., Patel, M.K. and Ewer, J. (2001) Simulating one of the CIB W14 round robin test cases using the SMARTFIRE fire field model. Fire Safety Journal, 36 (7). pp. 661-677. ISSN 0379-7112 (doi:10.1016/S0379-7112(01)00018-2)

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

CFD pipe bends

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

CFD analysis

Kiani, Nageena, Patel, Mayur and Lai, Choi-Hong (2007) CFD analysis of one-dimensional infiltration in vadose zone. Journal of Algorithms & Computational Technology, 1 (4). pp. 477-493. ISSN 1748-3018 (doi:10.1260/174830107783133897)

CFD fire simulation

Jia, F., Patel, M.K., Galea, E.R., Grandison, A. and Ewer, J. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire - part II: fire spread analysis. The Aeronautical Journal of the Royal Aeronautical Society, 110 (1107):3069. pp. 303-314. ISSN 0001-9240

CFD simulation

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

CFD software

Cross, M., Lyster, C, Bailey, C., Croft, N., Ewer, J., Leggett, P., McManus, K., Pericleous, K.A. and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

CFDS-FLOW3D

Jia, Fuchen, Galea, Edwin and Patel, Mayur (1998) The numerical simulation of enclosure fires using a Cfd fire field model coupled with a pyrolysis based solid fuel combustion submodel—a first approximation. Journal of Fire Protection Engineering, 9 (4). pp. 1-17. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159800900402)

characterisation

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

charring materials

Jia, F., Galea, E.R. and Patel, M.K. (1999) Numerical simulation of the mass loss process in pyrolizing char materials. Fire and Materials, 23 (2). pp. 71-78. ISSN 0308-0501 (Print), 1099-1018 (Online) (doi:10.1002/(SICI)1099-1018(199903/04)23:2<71::AID-FAM672>3.0.CO;2-5)

China

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 1: History, present and future of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 153-163. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213585)

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 2: Urban rail transit systems, highway transport and the reform of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 165-174. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213594)

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

chip scale packaging

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

chip-on-board (COB) assembly

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

chip-on-board packaging

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

chip-on-flex (COF)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

circuit optimisation

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

circuit reliability

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

circuit simulation

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

circuits

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

Coffin-Manson

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

cognition

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:10.1002/pamm.200700212)

compartment fires

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

complex geometries

Cross, Mark, Bailey, Christopher, Pericleous, Koulis, Williams, Alison, Bojarevics, Valdis, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

composite

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

compuational fluid dynamics (CFD)

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

computater modelling

Wang, Junye, Christakis, Nicholas, Patel, Mayur K., Cross, Mark and Leaper, Mark C. (2004) A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions. Numerical Heat Transfer, Part A: Applications, 45 (8). pp. 751-776. ISSN 1040-7782 (Print), 1521-0634 (Online) (doi:10.1080/10407780490424280)

computational

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

computational analysis software

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

computational complexity

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

computational fluid dynamics

Bailey, C., Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

Burton, D.J., Grandison, Angus, Patel, Mayur, Galea, Edwin R. and Ewer, John (2007) Introducing a hybrid field/zone modelling approach for fire simulation. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1491-1497. ISBN 9780954121693

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. and Pericleous, K. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:10.1109/STHERM.2004.1291335)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Turbulence modelling and its effects on electronic systems. In: Turbulence, Heat and Mass Transfer 4. Begell House, New York, USA. Oxfordshire, UK, pp. 625-632. ISBN 1567001963

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Turbulence modelling for thermal management of electronic systems. In: 12th Association of Computational Mechanics in Engineering Annual Conference (ACME 2004), 5-6 April 2004, Cardiff, Wales, UK. (Unpublished)

Dhinsa, Kulvir K., Bailey, Chris J. and Pericleous, Koulis A. (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Ewer, J., Galea, E.R., Patel, M.K., Taylor, S., Knight, B. and Petridis, M. (1999) SMARTFIRE: an intelligent CFD based fire model. Journal of Fire Protection Engineering, 10 (1). pp. 13-27. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159901000102)

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

Janes, D., Ewer, J., Galea, E., Patel, M. and Knight, B. (2001) Automatic dynamic control of CFD base fire modelling simulations. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 811-822. ISBN 0953231283

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

Jia, F., Patel, M.K. and Galea, E.R. (2004) Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE. In: Fourth Triennial International Fire and Cabin Safety Research Conference, 15–19 Nov 2004, Lisbon, Portugal.

Jia, Fuchen, Patel, Mayur and Galea, Edwin (2003) Flight simulation. Fire Prevention & Fire Engineers Journal, 2003 (Sept.). pp. 27-29. ISSN 1478-3576

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Patel, M.K., Bailey, C., Djambazov, G., Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684363)

Yao, Jun, Yao, Yufeng, Mason, Peter J. and Patel, Mayur (2009) Numerical simulation of heat transfer in rectangular microchannel. Advances in Applied Mathematics and Mechanics, 1 (2). pp. 231-241. ISSN 2070-0733 (Print), 2075-1354 (Online)

computational fluid dynamics (CFD)

Dhinsa, Kulvir, Bailey, Chris and Pericleous, Koulis (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

Jia, Fuchen, Galea, Edwin and Patel, Mayur (1998) The numerical simulation of enclosure fires using a Cfd fire field model coupled with a pyrolysis based solid fuel combustion submodel—a first approximation. Journal of Fire Protection Engineering, 9 (4). pp. 1-17. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159800900402)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

computational linguistics

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

computational mechanics

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Stoyanov, S., Bailey, C. and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

computational modeling

Cross, Mark, Bailey, Christopher, Pericleous, Koulis, Williams, Alison, Bojarevics, Valdis, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

computational modelling

Chapelle, P., Christakis, N., Abou-Chakra, H., Tuzun, U., Bridle, I., Bradley, M.S.A., Patel, M.K. and Cross, M. (2003) Computational modelling of particle degradation in dilute phase pneumatic conveyors. In: Kumar, Vipin, Gavrilova, Marina L., Tan, Chih Jeng Kenneth and L’Ecuyer, Pierre, (eds.) Computational Science and Its Applications - ICCSA 2003. International Conference Montreal, Canada, May 18–21, 2003 Proceedings. Lecture Notes in Computer Science, Part I (2667). Springer, Berlin Heidelberg, pp. 493-502. ISBN 9783540401551 (doi:10.1007/3-540-44839-X_53)

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C., Bailey, C. and Pericleous, K.A. (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

Cross, Mark, Stoyanov, Stoyan, Mouchmov, Apostol, Lu, Hua, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris and Pericleous, Koulis (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

Grossman, D., Bailey, C., Pericleous, K. and Slone, A. (2002) Computational modelling of blood flow and artery wall interaction. In: FEM Workshop 2002 [Proceedings]. University of Ulm, Germany, Ulm, Germany, pp. 88-94. ISBN 39806183558

Patel, M.K., Bailey, C., Djambazov, G., Shrimpton, J. and Jalili, V. (2003) Application of CFD in vacuum dezincing process. In: The 3rd International Conference on CFD in the Minerals and Process Industries [Proceedings]. CSIRO Publishing, Collingwood, Victoria, Australia, pp. 313-318. ISBN 978064309038X

computational solid mechanics

Bailey, C., Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

Taylor, G.A., Bailey, C. and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:10.1002/nme.574)

computational study

Christakis, N., Chapelle, P. and Patel, M.K. (2006) A computational study of segregation in granular material during heaping. In: 2006 Spring Meeting & 2nd Global Congress on Process Safety. American Institute of Chemical Engineers, New York, USA. ISBN 9780816910755

computer aided analysis

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

computer modelling

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

Janes, D., Ewer, J., Galea, E., Patel, M. and Knight, B. (2001) Automatic dynamic control of CFD base fire modelling simulations. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 811-822. ISBN 0953231283

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

Computer models

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

computer simulation

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:10.1016/S0304-8853(96)00345-9)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

condensed matter: electrical

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

condensed matter: structural

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

conducting materials

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

conducting polymers

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

conductive adhesive

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

conductive adhesives

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

conductive particle

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

conservation

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

constituitive modeling

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

constitutive law

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

constraints

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

contact angle

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

contact resistance

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

Yin, C.Y., Alam, M.O., Chan, Y.C., Bailey, C. and Lu, Hua (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

contactless

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

continuum mechanics

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K., Wang, Junye, Cross, Mark, Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Bridle, Ian and Leaper, Mark C. (2002) Mathematical modelling of the behaviour of granular material in a computational fluid dynamics framework using micro-mechanical models. In: 5th World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

continuum model

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

Christakis, N., Chapelle, Pierre and Patel, M. K. (2006) Analysis and modeling of heaping behavior of granular mixtures within a computational mechanics framework. Advanced Powder Technology, 17 (4). pp. 383-398. ISSN 0921-8831 (doi:10.1163/156855206777866173)

continuum modelling

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

Christakis, Nicholas, Patel, Mayur and Cross, Mark (2001) Predictions of Segregation of Granular Material with the Aid of PHYSICA, a 3-D Unstructured Finite-Volume Modelling Framework. In: ICFD Conference on Numerical Methods for Fluid Dynamics, 26-29 March 2001, Oxford, UK.

Christakis, Nicholas, Patel, Mayur K., Cross, Mark, Baxter, John, Abou-Chakra, Hadi and Tuzun, Ugur (2002) Predictions of segregation of granular material with the aid of PHYSICA, a 3-D unstructured finite-volume modelling framework. In: International Journal for Numerical Methods in Fluids. Special Issue: ICFD Conference on Numerical Methods for Fluid Dynamics. John Wiley & Sons, Ltd., pp. 281-291. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.319)

convection oven

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

cooling

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

cooling electronics packaging

Dhinsa, Kulvir K., Bailey, Chris J. and Pericleous, Koulis A. (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

coordinate transformation

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:10.1007/3-540-28073-1)

copper

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Lu, Hua and Bailey, Chris (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

copper alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

copper track designs

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

core flow

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

corrosion fatigue

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

coupled electromagnetic and heat transfer computations

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

coupled heat and moisture transfer

Wang, Junye, Christakis, Nicholas, Patel, Mayur K., Cross, Mark and Leaper, Mark C. (2004) A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions. Numerical Heat Transfer, Part A: Applications, 45 (8). pp. 751-776. ISSN 1040-7782 (Print), 1521-0634 (Online) (doi:10.1080/10407780490424280)

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

coupled solution

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

coupled solvers

Dinčov, Duško D., Parrott, Kevin A. and Pericleous, Koulis A. (2002) Coupled 3-D finite difference time domain and finite volume methods for solving microwave heating in porous media. In: Sloot, Peter A., Hoekstra, Alfons G., Tan, C.J. Kenneth and Dongarra, Jack J., (eds.) Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, I (2329). Springer-Verlag, Berlin, Heidelberg, Germany, pp. 813-822. ISBN 9783540435914 (doi:10.1007/3-540-46043-8_82)

coupling

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

crack detection

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

crack propagation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Rafii-Tabar, Hashem, Lu, Hua and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/10/11/003)

cracking

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

crash dynamics

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

crash simulation

Xue, Xiangdong, Schmid, F. and Smith, R. (2007) Analysis of the structural characteristics of an intermediate rail vehicle and their effect on vehicle crash performance. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 221 (F3). pp. 339-352. ISSN 0954-4097 (doi:10.1243/09544097JRRT77)

crashworthiness

Xue, X., Schmid, F. and Smith, R.A. (2004) A study of modelling approaches for rail vehicle collision behaviour. International Journal of Crashworthiness, 9 (5). pp. 515-525. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2004.0307)

Xue, X., Smith, R. and Schmid, F. (2005) Analysis of crush behaviours of a rail cab car and structural modifications for improved crashworthiness. International Journal of Crashworthiness, 10 (2). pp. 125-136. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2005.0332)

Xue, Xiangdong, Schmid, F. and Smith, R. (2007) Analysis of the structural characteristics of an intermediate rail vehicle and their effect on vehicle crash performance. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 221 (F3). pp. 339-352. ISSN 0954-4097 (doi:10.1243/09544097JRRT77)

creep

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Warner, Matt, Parry, John, Bailey, Chris and Lu, Hua (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

creep curves

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

crystal orientation

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

crystal structure

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

crystal symmetry

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

crystals

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

Cu column

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Cu columns

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

Cu trace

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

cure

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

cure process

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

curing

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

Wheeler, D. and Bailey, C. (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

curing process

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

current crowding

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

current density

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

current stressing

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

Cutty Sark

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

CV²

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

data driven prognostics

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

data-driven prognostics

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

DC magnetic pump

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

DC-DC

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

DC-DC power converter

Flynn, David, Lu, Hua, Bailey, Chris and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

decision support system

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

defects

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Deformable objects

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

degradation

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

degradation tester

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

delamination

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

demagnetization

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

dendritic growth

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

dendritic-growth

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur K. and Voller, Vaughan R. (2010) Thermoelectric effects on alloy solidification microstructure. In: Cockcroft, Steve L. and Maijer, Daan M., (eds.) Modeling of Casting, Welding, and Advanced Solidification Processes. John Wiley & Sons, Inc. / The Minerals, Metals & Materials Society, Warrendale, PA, USA, pp. 521-528. ISBN 978-0-87339-742-1 (hbk)

dense suspension

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

density dependence

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

deposition

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

design

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

Bailey, Christopher (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:10.1109/HDP.2006.1707617)

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

design for manufacture

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Design for Reliability modelling

Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

design methodology

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Design of Experiment (DoE) method

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

design of experiments

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

design optimistation

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

design-for-reliability

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

diagnostic techniques

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

die attach

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

dielectric material

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

differential scanning calorimetry (DSC)

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

diffusion

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

digital simulation

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

dilute phase

Chapelle, P., Christakis, N., Abou-Chakra, H., Tuzun, U., Bridle, I., Bradley, M.S.A., Patel, M.K. and Cross, M. (2003) Computational modelling of particle degradation in dilute phase pneumatic conveyors. In: Kumar, Vipin, Gavrilova, Marina L., Tan, Chih Jeng Kenneth and L’Ecuyer, Pierre, (eds.) Computational Science and Its Applications - ICCSA 2003. International Conference Montreal, Canada, May 18–21, 2003 Proceedings. Lecture Notes in Computer Science, Part I (2667). Springer, Berlin Heidelberg, pp. 493-502. ISBN 9783540401551 (doi:10.1007/3-540-44839-X_53)

dilute phase pneumatic conveying

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

dilute-phase pneumatic conveying

Chapelle, Pierre, Christakis, Nicholas, Abou-Chakra, Hadi, Bridle, Ian, Bradley, M.S.A., Patel, Mayur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute-phase pneumatic conveying: modeling of dilute-phase pneumatic conveying. Advanced Powder Technology, 15 (1). pp. 31-49. ISSN 0921-8831 (Print), 1568-5527 (Online) (doi:10.1163/15685520460740052)

direct chill casting process

Cross, M., Williams, A., Bailey, C., Taylor, G.A., Pericleous, K. and Croft, T.N. (2000) Towards a comprehensive model of the direct chill casting process. In: Modeling of Casting, Welding and Advanced Solidification Processes IX [Proceedings]. Shaker, Aachen, Germany, pp. 713-720. ISBN 3826572300

discrete element

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

disordered solids

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

dispersion relations

Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:10.1006/jcph.2001.6753)

dissolving

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

distributed manipulation

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

domain walls

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

ductility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

dynamic fluid-structure interaction

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

dynamic load balancing

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

dynamic solid mechanics

Slone, A.K., Bailey, C. and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:10.1016/S0307-904X(02)00060-4)

eddy dissipation model (EDM)

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R. and Patel, Mayur (2007) Predicting toxic species concentrations in a full-scale vitiated fire. Interflam 2007 11th International Fire Science and Engineering Conference. Interflam, 2 . Interscience Communications Ltd, London, pp. 1047-1058. ISBN 9780954121693

edge elements

Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:10.1006/jcph.2001.6753)

effect of reflow process

Yin, C.Y., Alam, M.O., Chan, Y.C., Bailey, C. and Lu, Hua (2003) The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability, 43 (4). pp. 625-633. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00348-7)

effluent toxicity

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

electric aircraft

Newcombe, D. R. and Bailey, C. (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electric car

Newcombe, D. R. and Bailey, C. (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

electrical connections

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

electro-migration

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

electrodeposition

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

electrodeposition of copper

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

electroless Ni–P layer

Alam, M.O., Chan, Y.C. and Hung, K.C. (2002) Reliability study of the electroless Ni–P layer against solder alloy. Microelectronics Reliability, 42 (7). pp. 1065-1073. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00068-9)

electrolytes

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

electromagnetic simulation software

Janssen, R., Dracopoulos, M., Parrott, K., Slessor, E., Alotto, P., Molfino, P., Nervi, M. and Simkin, J. (1998) Parallelisation of electromagnetic simulation codes. IEEE Transactions on Magnetics, 34 (5). pp. 3423-3426. ISSN 0018-9464 (doi:10.1109/20.717806)

electromagnetic compatibility

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electromagnetic field

Hughes, Michael, Pericleous, Koulis and Strusevitch, Nadia (2002) Modelling the fluid dynamics and coupled phenomena in arc weld pools. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 63-81. ISBN 9781902653563

electromagnetic finite codes

Dracopoulos, M., Parrott, K., Molinari, G., Nervi, M. and Simkin, J. (1997) Results of parallelisation of existing electromagnetic finite codes on some different parallel architectures. Applied Computational Electromagnetics Society Journal, 12 (2). pp. 107-112. ISSN 1054-4887

electromagnetic pump/brake

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

electromagnetic radiation

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) A new computational approach to microwave heating of two-phase porous materials. International Journal of Numerical Methods for Heat & Fluid Flow, 14 (6). pp. 783-802. ISSN 0961-5539 (doi:10.1108/09615530410544319)

electromechanical devices

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

electromigration

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua, Mannan, Samjid, Bailey, Chris and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

electron bombardment

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

electronic applications

Dhinsa, Kulvir, Bailey, Chris and Pericleous, Koulis (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

electronic design automation

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electronic engineering

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronic engineering computing

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

electronic packages

Stoyanov, S., Bailey, C. and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

electronic packaging

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Stoyanov, S. and Bailey, C. (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

electronic product assembly

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

electronic product design

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

electronic production design

Bailey, C. (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

electronic products

Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

electronics design

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

electronics industry

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

electroplating

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

Strusevich, Nadia, Bailey, Chris, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:10.1109/EuroSimE.2013.6529989)

electrostatic

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:10.1039/c3ra40188j)

embedded die

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

embrittlement

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

empirical model

Deng, T., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of particle concentration on erosion rate of mild steel bends in a pneumatic conveyor. Wear, 258 (1-4). pp. 480-487. ISSN 0043-1648 (doi:10.1016/j.wear.2004.08.001)

encapsulant

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

encapsulant curing

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

enclosure fires

Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Galea, Edwin R. (2007) Modelling generation and transport of toxic combustion products in enclosure fires using bench-scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1631-1636. ISBN 9780954121693

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

energy

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2007) Numerical simulation of incompressible flow problems using an unstructured staggered mesh method. Journal of Algorithms and Computational Technology, 1 (3). pp. 273-302. ISSN 1748-3018 (doi:10.1260/174830107782424066)

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

engineering computing

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

enthalpy

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur K. and Voller, Vaughan R. (2010) Thermoelectric effects on alloy solidification microstructure. In: Cockcroft, Steve L. and Maijer, Daan M., (eds.) Modeling of Casting, Welding, and Advanced Solidification Processes. John Wiley & Sons, Inc. / The Minerals, Metals & Materials Society, Warrendale, PA, USA, pp. 521-528. ISBN 978-0-87339-742-1 (hbk)

environmental conditions

Wang, Junye, Christakis, Nicholas, Patel, Mayur K., Cross, Mark and Leaper, Mark C. (2004) A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions. Numerical Heat Transfer, Part A: Applications, 45 (8). pp. 751-776. ISSN 1040-7782 (Print), 1521-0634 (Online) (doi:10.1080/10407780490424280)

equiaxed crystal morphology

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur and Voller, V. (2009) Thermoelectric MHD effects on equiaxed crystal morphology. 6th International Conference on Electromagnetic Processing of Materials, EPM 2009. Forschungszentrum Dresden-Rossendorf, Dresden, Germany. ISBN Forschungszentrum Dresden-Rossendorf

erosion

Deng, T., Li, J., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Comparison between weight loss of bends in a pneumatic conveyor and erosion rate obtained in a centrifugal erosion tester for the same materials. Wear, 258 (1-4). pp. 402-411. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.012)

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

Euler-Lagrange approach

Mawhinney, R.N., Galea, E.R. and Patel, M.K. (1996) Fire-sprinkler spray interaction modelling using an Euler-Lagrange approach. In: Conference Proceedings: Interflam '96: Seventh International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 841-845. ISBN 0951632094

Eulerian

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

eutectic alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

evacuation models

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

evaluation

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

event history analysis

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

expert system

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

explosions

Vince, Ivan and Patel, Mayur (2006) Explosion in fume cupboard damages several laboratories. Loss Prevention Bulletin, 187. pp. 6-8. ISSN 0260-9576

fabrication

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

failure

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

failure analysis

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

failure based reliability

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

failure mechanisms

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

failure modes

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

fatigue

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

fatigue life-time

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

fatigue of materials

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

FEA

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

ferrous operations

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. and Pericleous, K. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

field model

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

field modelling

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

field models

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

filled polymers

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

films (states of matter)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

fine-pitch technology

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

finite difference

Parrott, Kevin and Rout, Sweta (2006) Semi-Lagrange time integration for PDE models of asian options. Progress in Industrial Mathematics at ECMI 2004. Mathematics in Industry, 8 . Springer Berlin / Heidelberg, Berlin, pp. 432-436. ISBN 9783540280729 (doi:10.1007/3-540-28073-1)

finite difference method

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:10.1080/135048699334528)

finite difference time-domain analysis

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Fallah, N.A., Bailey, C., Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00047-5)

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

finite element (FE) method

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

finite element analysis

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

Stoyanov, S. and Bailey, C. (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

finite element analysis (FEA)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

Finite Element Analysis(FEA)

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

finite element method

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

finite element methods

Janssen, R., Dracopoulos, M., Parrott, K., Slessor, E., Alotto, P., Molfino, P., Nervi, M. and Simkin, J. (1998) Parallelisation of electromagnetic simulation codes. IEEE Transactions on Magnetics, 34 (5). pp. 3423-3426. ISSN 0018-9464 (doi:10.1109/20.717806)

finite element modeling

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

finite element modelling

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

finite volume

Fallah, N.A., Bailey, C. and Cross, M. (2000) CFD approach for solid mechanics analysis. In: European Congress on Computational Methods in Applied Sciences and Engineering. ECCOMAS 2000. [Proceedings]. ECCOMAS.

Fallah, N.A., Bailey, C., Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00047-5)

Slone, A.K., Cross, M., Pericleous, K.A. and Bailey, C. (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

Taylor, G.A., Bailey, C. and Cross, M. (2002) A vertex-based finite volume method applied to non-linear material problems in computational solid mechanics. International Journal for Numerical Methods in Engineering, 56 (4). pp. 507-529. ISSN 0029-5981 (Print), 1097-0207 (Online) (doi:10.1002/nme.574)

finite volume method

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

finite volume methods

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Slone, A.K., Bailey, C. and Cross, M. (2002) Dynamic solid mechanics using finite volume methods. Applied Mathematical Modelling, 27 (2). pp. 69-87. ISSN 0307-904X (doi:10.1016/S0307-904X(02)00060-4)

Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:10.1016/S0307-904X(01)00063-4)

finite volume unstructured mesh

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

finite volumes

Bailey, C., Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

finite-difference schemes

Lai, C.-H., Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:10.1016/j.camwa.2004.03.014)

finite-volume code

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

fire compartments

Kerrison, L., Galea, E.R. and Patel, M.K. (1998) A two-dimensional numerical investigation of the oscillatory flow behaviour in rectangular fire compartments with a single horizontal ceiling vent. Fire Safety Journal, 30 (4). pp. 357-382. ISSN 0379-7112 (doi:10.1016/S0379-7112(97)00042-8)

FIRE Detection and Suppression Simulation

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

fire field model

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

fire field modelling

Burton, D.J., Grandison, Angus, Patel, Mayur, Galea, Edwin R. and Ewer, John (2007) Introducing a hybrid field/zone modelling approach for fire simulation. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 1491-1497. ISBN 9780954121693

fire modelling

Ewer, J., Galea, E.R., Knight, B., Patel, M., Janes, D. and Petridis, M. (1998) Fire field modelling using the SMARTFIRE automated dynamic solution control environment. CMS Press, Greenwich, London, UK. ISBN 1899991387

Ewer, J., Galea, E.R., Patel, M.K., Taylor, S., Knight, B. and Petridis, M. (1999) SMARTFIRE: an intelligent CFD based fire model. Journal of Fire Protection Engineering, 10 (1). pp. 13-27. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159901000102)

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (1999) The development and application of group solvers in the SMARTFIRE fire field model. In: Conference Proceedings: Interflam 1999: 8th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 939-950. ISBN 0953231232

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (2000) The development of group solvers in the SMARTFIRE fire field model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 54-57. ISBN 1861661509

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2006) A suggested procedure for benchmarking fire field models. International Journal on Engineering Performance-Based Fire Codes, 8 (4). pp. 132-144. ISSN 1561-9559

Jia, F., Galea, E.R, and Patel, M.K. (2000) The numerical simulation of compartment fires using an integrated gas and solid phase combustion model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 50-53. ISBN 1861661509

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of fire spread within a compartment using an integrated gas and solid phase combustion model. Journal of Applied Fire Science, 8 (4). pp. 327-352. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/UY41-W38Q-X6KK-TXYV)

Jia, F., Patel, M.K. and Galea, E.R. (2004) Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE. In: Fourth Triennial International Fire and Cabin Safety Research Conference, 15–19 Nov 2004, Lisbon, Portugal.

Jia, Fuchen, Galea, Edwin and Patel, Mayur (1998) The numerical simulation of enclosure fires using a Cfd fire field model coupled with a pyrolysis based solid fuel combustion submodel—a first approximation. Journal of Fire Protection Engineering, 9 (4). pp. 1-17. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159800900402)

Jia, Fuchen, Patel, Mayur and Galea, Edwin (2003) Flight simulation. Fire Prevention & Fire Engineers Journal, 2003 (Sept.). pp. 27-29. ISSN 1478-3576

Mawhinney, R.N., Galea, E.R. and Patel, M.K. (1996) Fire-sprinkler spray interaction modelling using an Euler-Lagrange approach. In: Conference Proceedings: Interflam '96: Seventh International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 841-845. ISBN 0951632094

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

Taylor, S., Galea, E., Patel, M. and Petridis, M. (1996) SMARTFIRE: an intelligent fire field model. In: Conference Proceedings: Interflam '96: Seventh International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 671-680. ISBN 0951632094

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

Taylor, S., Petridis, M., Knight, B., Ewer, J., Galea, E.R. and Patel, M. (1997) SMARTFIRE: an integrated computational fluid dynamics code and expert system for fire field modelling. In: Fire Safety Science: Proceedings of the Fifth International Symposium. International Association for Fire Safety Science, Greenwich, London, UK, pp. 1285-1296. ISBN 4990062555 (doi:10.3801/IAFSS.FSS.5-1285)

Wang, Z., Jia, F., Galea, E.R., Patel, M.K. and Ewer, J. (2001) Simulating one of the CIB W14 round robin test cases using the SMARTFIRE fire field model. Fire Safety Journal, 36 (7). pp. 661-677. ISSN 0379-7112 (doi:10.1016/S0379-7112(01)00018-2)

fire safety

Frost, Ian, Patel, Mayur, Galea, Edwin R., Rymacrzyk, P. and Mawhinney, Robert (2001) A semi-automated approach to CAD input into field based fire modelling tools. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1421-1426. ISBN 1899991832

Galea, E. (2006) CFD fire simulation of the Swissair flight 111 in-flight fire – Part 1: Prediction of the pre-fire air flow within the cockpit and surrounding areas. The Aeronautical Journal, 110 (1103). ISSN 0001-9240

fire simulation

Ewer, J., Galea, E.R., Patel, M.K., Taylor, S., Knight, B. and Petridis, M. (1999) SMARTFIRE: an intelligent CFD based fire model. Journal of Fire Protection Engineering, 10 (1). pp. 13-27. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159901000102)

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

fire simulation software

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (1999) The development and application of group solvers in the SMARTFIRE fire field model. In: Conference Proceedings: Interflam 1999: 8th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 939-950. ISBN 0953231232

Ewer, J.A.C., Galea, E.R., Patel, M.K. and Knight, B. (2000) The development of group solvers in the SMARTFIRE fire field model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 54-57. ISBN 1861661509

Janes, D., Ewer, J., Galea, E., Patel, M. and Knight, B. (2001) Automatic dynamic control of CFD base fire modelling simulations. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 811-822. ISBN 0953231283

Jia, F., Patel, M. and Galea, E. (2004) CFD fire simulation of the Swissair flight 111 in-flight fire. In: Conference Proceedings: Interflam 2004: 10th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1195-1206. ISBN 0954121643

Jia, Fuchen, Patel, Mayur and Galea, Edwin (2003) Flight simulation. Fire Prevention & Fire Engineers Journal, 2003 (Sept.). pp. 27-29. ISSN 1478-3576

fire test

Wang, Z., Jia, F., Galea, E.R., Patel, M.K. and Ewer, J. (2001) Simulating one of the CIB W14 round robin test cases using the SMARTFIRE fire field model. Fire Safety Journal, 36 (7). pp. 661-677. ISSN 0379-7112 (doi:10.1016/S0379-7112(01)00018-2)

fire-field modelling

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

flashover

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

Flex-No-Lead project

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

flexible substrates

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

flexible-substrates

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flight simulation

Jia, F., Patel, M.K. and Galea, E.R. (2004) Simulating the Swissair flight 111 in-flight fire using the CFD fire simulation software SMARTFIRE. In: Fourth Triennial International Fire and Cabin Safety Research Conference, 15–19 Nov 2004, Lisbon, Portugal.

flip chip

Bailey, Christopher, Lu, Hua, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:10.1108/03056120210696658)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Stoyanov, S., Bailey, C. and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

flip chip devices

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

flip chip on flex

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

flip chip packaging

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

flip chip technology

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

flip-chip

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

flip-chip assembly

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

flip-chip devices

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

Lu, Hua and Bailey, Chris (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

flip-chip devices printed circuit manufacture

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

flip-chip packaging

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

flip-chip underfills

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

flipchip

Wheeler, D. and Bailey, C. (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

flow

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

flow behaviour

Hughes, Michael, Pericleous, Koulis and Strusevitch, Nadia (2002) Modelling the fluid dynamics and coupled phenomena in arc weld pools. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 63-81. ISBN 9781902653563

flow simulation

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

flow solution

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

fluctuations

Dhinsa, Kulvir K., Bailey, Chris J. and Pericleous, Koulis A. (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

fluid dynamics

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:10.1016/S0307-904X(01)00063-4)

fluid flow

Bailey, C., Bounds, S., Cross, M., Moran, G, Pericleous, K. and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Dhinsa, Kulvir, Bailey, Chris and Pericleous, Koulis (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

fluid mechanics

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

fluid structure interaction

Slone, A.K., Cross, M., Pericleous, K.A. and Bailey, C. (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

fluids engineering descriptors

Bailey, C., Bounds, S., Cross, M., Moran, G, Pericleous, K. and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

fluid–structure interaction

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

flux

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

flux symmetries

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

focused ion beam

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan, Ridout, Stephen and Bailey, Chris (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

Focused Ion Beam (FIB) method

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

foil

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

forced convection

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

Fourier transform infra-red spectroscopy (FTIR)

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

Fractals

Pericleous, Kyriacos A and Dempsey, Stephen (1995) Turbulent flow simulation using a fractal based LES model. Journal of Fluid Engineering, 208. pp. 61-66.

Fractional Effective Dose (FDE)

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

fracture

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

fracture mechanics

Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

fracture propogation path

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

fractures

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

frequency agile microwave oven bonding system (FAMOBS)

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

gas flow

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

gaseous combustion model

Jia, F., Galea, E.R, and Patel, M.K. (2000) The numerical simulation of compartment fires using an integrated gas and solid phase combustion model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 50-53. ISBN 1861661509

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of fire spread within a compartment using an integrated gas and solid phase combustion model. Journal of Applied Fire Science, 8 (4). pp. 327-352. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/UY41-W38Q-X6KK-TXYV)

geometric conservation law

Slone, A.K., Cross, M., Pericleous, K.A. and Bailey, C. (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

geometric mesh partitioning methods

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

geometrically nonlinear

Fallah, N.A., Bailey, C., Cross, M. and Taylor, G.A. (2000) Comparison of finite element and finite volume methods application in geometrically nonlinear stress analysis. Applied Mathematical Modelling, 24 (7). pp. 439-455. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00047-5)

geometry

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

glass transition temperature

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

glob top

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

globtop

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

globtop design

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

granular flow

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

granular flows

Christakis, N., Chapelle, P. and Patel, M.K. (2006) A computational study of segregation in granular material during heaping. In: 2006 Spring Meeting & 2nd Global Congress on Process Safety. American Institute of Chemical Engineers, New York, USA. ISBN 9780816910755

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

granular material

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K., Wang, Junye, Cross, Mark, Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Bridle, Ian and Leaper, Mark C. (2002) Mathematical modelling of the behaviour of granular material in a computational fluid dynamics framework using micro-mechanical models. In: 5th World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

Christakis, Nicholas, Patel, Mayur and Cross, Mark (2001) Predictions of Segregation of Granular Material with the Aid of PHYSICA, a 3-D Unstructured Finite-Volume Modelling Framework. In: ICFD Conference on Numerical Methods for Fluid Dynamics, 26-29 March 2001, Oxford, UK.

Christakis, Nicholas, Patel, Mayur K., Cross, Mark, Baxter, John, Abou-Chakra, Hadi and Tuzun, Ugur (2002) Predictions of segregation of granular material with the aid of PHYSICA, a 3-D unstructured finite-volume modelling framework. In: International Journal for Numerical Methods in Fluids. Special Issue: ICFD Conference on Numerical Methods for Fluid Dynamics. John Wiley & Sons, Ltd., pp. 281-291. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.319)

granular materials

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

granular mixtures

Christakis, N., Chapelle, Pierre and Patel, M. K. (2006) Analysis and modeling of heaping behavior of granular mixtures within a computational mechanics framework. Advanced Powder Technology, 17 (4). pp. 383-398. ISSN 0921-8831 (doi:10.1163/156855206777866173)

health monitoring

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

heaping

Christakis, N., Chapelle, P. and Patel, M.K. (2006) A computational study of segregation in granular material during heaping. In: 2006 Spring Meeting & 2nd Global Congress on Process Safety. American Institute of Chemical Engineers, New York, USA. ISBN 9780816910755

Christakis, N., Chapelle, Pierre and Patel, M. K. (2006) Analysis and modeling of heaping behavior of granular mixtures within a computational mechanics framework. Advanced Powder Technology, 17 (4). pp. 383-398. ISSN 0921-8831 (doi:10.1163/156855206777866173)

heat conduction

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

heat dissipation

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

heat exchangers

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

heat sensitive film

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

heat sinks

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

heat transfer

Alessandri, E., Mawhinney, R.N., Patel, Mayur and Galea, Edwin R. (1996) Revisiting the carrier-phase source-term formulation in mixed Lagrangian-Eulerian particle models. Numerical Heat Transfer, Part B: Fundamentals, 30 (1). pp. 111-116. ISSN 1521-0626 (electronic) 1040-7790 (paper) (doi:10.1080/10407799608915074)

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. In: 2004 Proceedings, Twentieth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM). Institute of Electrical and Electronics Engineers, Inc,, Piscataway, NJ, USA, pp. 278-285. ISBN 078038363X ISSN 1065-2221 (doi:10.1109/STHERM.2004.1291335)

Dhinsa, Kulvir, Bailey, Chris and Pericleous, Koulis (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Hughes, Michael, Pericleous, Koulis and Strusevitch, Nadia (2002) Modelling the fluid dynamics and coupled phenomena in arc weld pools. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 63-81. ISBN 9781902653563

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

heating

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

heritage structures

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

heterogeneity

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

high aspect ratio microvia

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

high current density induced damage

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

high density interconnection technology

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

high density packaging

Bailey, Christopher (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:10.1109/HDP.2006.1707617)

high performance

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C., Bailey, C. and Pericleous, K.A. (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

high performance computing

Janssen, R., Dracopoulos, M., Parrott, K., Slessor, E., Alotto, P., Molfino, P., Nervi, M. and Simkin, J. (1998) Parallelisation of electromagnetic simulation codes. IEEE Transactions on Magnetics, 34 (5). pp. 3423-3426. ISSN 0018-9464 (doi:10.1109/20.717806)

High Performance Primitive Collections

McManus, K., Cross, M., Walshaw, C., Johnson, S., Bailey, C., Pericleous, K., Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:10.1016/B978-044482851-4.50009-8)

highway

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 2: Urban rail transit systems, highway transport and the reform of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 165-174. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213594)

historic

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

history

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 1: History, present and future of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 153-163. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213585)

Hopper configuration

Xia, Y., Häuser, J., Patel, M.K. and Cross, M. (2001) Feature-oriented grid topology design for aerospace configurations. In: Deutscher Luft- und Raumfahrtkongress 2001, 17-20 Sep 2001, Hamburg, Germany.

host–parasitoid interactions

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

Hot Solder Dip

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

hot solder dip process

Stoyanov, Stoyan, Bailey, Chris, Alam, M.O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

HPPC

McManus, K., Cross, M., Walshaw, C., Johnson, S., Bailey, C., Pericleous, K., Slone, A. and Chow, P. (2000) Virtual manufacturing and design in the real world - implementation and scalability on HPPC systems. In: Parallel Computational Fluid Dynamics 1999: Towards Teraflops, Optimization and Novel Formulations. North-Holland, Amsterdam, The Netherlands, pp. 47-56. ISBN 978044482851 (doi:10.1016/B978-044482851-4.50009-8)

hydrogen chloride

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Predicting HCl concentrations in fire enclosures using an HCl decay model coupled to a CFD-based fire field model. Fire and Materials, 31 (7). pp. 443-461. ISSN 0308-0501 (doi:10.1002/fam.942)

IGBT module

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

impact

Chapelle, Pierre, Abou-Chakra, Hadi, Christakis, Nicholas, Patel, Mayur, Abu-Nahar, Azlina, Tüzün, Ugur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute phase pneumatic conveying: the use of a laboratory scale degradation tester for the determination of degradation propensity. Advanced Powder Technology, 15 (1). pp. 13-29. ISSN 0921-8831 (doi:10.1163/15685520460740043)

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

impact degradation

Chapelle, Pierre, Christakis, Nicholas, Abou-Chakra, Hadi, Bridle, Ian, Bradley, M.S.A., Patel, Mayur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute-phase pneumatic conveying: modeling of dilute-phase pneumatic conveying. Advanced Powder Technology, 15 (1). pp. 31-49. ISSN 0921-8831 (Print), 1568-5527 (Online) (doi:10.1163/15685520460740052)

individual surface mount components

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

industrial plants

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

information visualisation

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:10.1002/pamm.200700212)

insulated gate bipolar transistors

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

integrated circuit

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

integrated circuit interconnections

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integrated circuit metallisation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

integrated circuit modelling

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

integrated circuit packaging

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

integrated circuit reliability

Dhinsa, K., Bailey, C. and Pericleous, K. (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2004) Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives. IEEE Transactions on Electronics Packaging Manufacturing, 27 (4). pp. 254-259. ISSN 1521-334X (doi:10.1109/TEPM.2004.843152)

integrated optoelectronics

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

integrated software module

Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

integration

Bailey, C., Bounds, S., Cross, M., Moran, G, Pericleous, K. and Taylor, G. (1999) Multiphysics modeling and its application to the casting process. CMSE: Computer Modelling & Simulation in Engineering, 4 (3). pp. 206-212. ISSN 1083-3455

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

interaction design

Parrott, Kevin and Tilford, Tim (2007) Numerical simulation of microwave thawing using a coupled solver approach. PAMM - Proceedings in Applied Mathematics and Mechanics, 7 (1). pp. 1150601-1150602. ISSN 1617-7061 (online) (doi:10.1002/pamm.200700212)

interactions

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

interconnections

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

interfaces (computer)

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

interfaces (materials)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

interfacial reaction

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

interfacial reaction phenomena

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound

Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

intermetallic compound (IMC)

Alam, M. O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound layer

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

intermetallic compounds (IMCs)

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

interpolation

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

iron

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

iron films

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

isolation substrate

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

isothermal fatigue test

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:10.1109/ESIME.2005.1502852)

isotropic conductive adhesives (ICAs)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

jet impingement cooling system

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

joints

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Joule heating

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:10.1016/j.actamat.2005.09.031)

kinematic-hardening

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

lab-on-a-chip

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

laboratories

Vince, Ivan and Patel, Mayur (2006) Explosion in fume cupboard damages several laboratories. Loss Prevention Bulletin, 187. pp. 6-8. ISSN 0260-9576

Lagrangian

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

Large

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

large-scale engineering processes

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

lase welding

Strusevich, Nadezhda V., Pericleous, Koulis and Hughes, Michael (2002) Characterisation of weldpool shapes in the laser welding of thick plates. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 83-92. ISBN 9781902653563

laser

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

laser beam welding

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

laser spot weld formation

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

LCD backlighting

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

lead

Djambazov, George Stefanov, Bailey, Chris, Patel, Mayur K. and Shrimpton, Jennifer (2004) Numerical simulation of vacuum dezincing of lead alloy. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

lead free applications

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

lead free solder

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

lead free solder interconnects

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

lead-free solder

Jackson, Gavin J., Lu, Hua, Durairaj, Raj, Hoo, Nick, Bailey, Chris, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-004-0094-x)

lead-free soldering

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

lead-free solders

Lu, Hua and Bailey, Chris (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

LED displays

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

LEDs

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

level set method

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

life cycle costing

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

life prediction

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

Life sized

Xue, Xiangdong (2005) Modelling collisions of rail vehicles with deformable objects. Technical Report. Rail and Safety Standards Board.

life testing

Stoyanov, S., Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

life-time

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

lifetime prediction

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

LIGA

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

light emitting diode (LED)

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

light emitting diodes

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:10.3390/mi3010078)

light emitting diodes (LEDs)

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

Local Area Networks

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

Lorentz force

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

loss modulus

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

low power tests

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

low temperature (T<100 C)

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

low-loss dielectric

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

magnetic and optical

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

magnetic domains

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

magnetization

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

magneto-hydrodynamics

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

magnetoelectric effects

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

magnetohydrodynamics

Kao, A., Pericleous, K., Patel, M.K. and Voller, V. (2009) Effects of magnetic fields on crystal growth. International Journal of Cast Metals Research, 22 (1-4). pp. 147-150. ISSN 1364-0461 (Print), 1743-1336 (Online) (doi:10.1179/136404609X367551)

manufacturing process

Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan, Ridout, Stephen and Bailey, Chris (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)

manufacturing processes

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Marangoni flow

Wheeler, D., Bailey, C. and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

maritime safety

Mawhinney, R.N., Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2000) The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel. Journal of Applied Fire Science, 9 (4). pp. 311-345. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/L07V-KGDD-KUPJ-D397)

materials processing

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

materials properties

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

materials science

Bailey, C., Patel, M. and Kumar, S. (2001) Computational modelling-a key component in materials processing. Transactions of the Institution of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 110 (1). pp. 25-32. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2001.110.1.25)

mathematical logic and formal languages

Woon, Fei Ling, Knight, Brian, Petridis, Miltos and Patel, Mayur (2005) CBE-conveyor: a case-based reasoning system to assist engineers in designing conveyor systems. In: Case-Based Reasoning Research and Development: 6th International Conference on Case-Based Reasoning, ICCBR 2005, Chicago, IL, USA, August 23-26, 2005. Proceedings. Lecture Notes in Computer Science (3620). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 640-651. ISBN 9783540281740 (doi:10.1007/11536406_48)

mathematical modelling

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

mathematical models

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

mathematical techniques

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

mathematics

Bailey, C., Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Maxwell equations

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Maxwell's equations

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) Heat and mass transfer in two-phase porous materials under intensive microwave heating. Journal of Food Engineering, 65 (2). pp. 403-412. ISSN 0260-8774 (doi:10.1016/j.jfoodeng.2004.02.011)

Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:10.1006/jcph.2001.6753)

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

mechanical & thermal

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Rotating-frame nuclear magnetic relaxation of spins diffusing on a disordered lattice: a Monte Carlo model. Journal of Physics: Condensed Matter, 9 (42). pp. 9097-9111. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/9/42/022)

mechanical testing printed circuit testing

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304033)

mechanics

Bailey, C., Clapham, S., Cross, M., Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 97-100. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

megasonic agitation

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C., Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

melting

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

melting processes

Cross, Mark, Bailey, Christopher, Pericleous, Koulis, Williams, Alison, Bojarevics, Valdis, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

MEMS device

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

mesh generation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris and Pericleous, Koulis (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

mesh sensitivity

Wang, Z., Jia, F., Galea, E.R., Patel, M.K. and Ewer, J. (2001) Simulating one of the CIB W14 round robin test cases using the SMARTFIRE fire field model. Fire Safety Journal, 36 (7). pp. 661-677. ISSN 0379-7112 (doi:10.1016/S0379-7112(01)00018-2)

metal migration

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

metal-hydrogen systems

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

metallic films

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

metals

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

metals casting

Bailey, C., Chow, P., Cross, M., Fryer, Y. and Pericleous, K. (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:10.1098/rspa.1996.0024)

metal–hydrogen systems

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

metro

Xue, X., Schmid, F. and Smith, R.A. (2002) An introduction to China's rail transport Part 2: Urban rail transit systems, highway transport and the reform of China's railways. Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit, 216 (3). pp. 165-174. ISSN 0954-4097 (Print), 2041-3017 (Online) (doi:10.1243/095440902760213594)

MHD

Kao, Andrew, Pericleous, Koulis A., Patel, Mayur K. and Voller, Vaughan R. (2010) Thermoelectric effects on alloy solidification microstructure. In: Cockcroft, Steve L. and Maijer, Daan M., (eds.) Modeling of Casting, Welding, and Advanced Solidification Processes. John Wiley & Sons, Inc. / The Minerals, Metals & Materials Society, Warrendale, PA, USA, pp. 521-528. ISBN 978-0-87339-742-1 (hbk)

MHD flow

Hughes, M., Pericleous, K.A. and Cross, M. (1995) The numerical modelling of DC electromagnetic pump and brake flow. Applied Mathematical Modelling, 19 (12). pp. 713-723. ISSN 0307-904X (doi:10.1016/0307-904X(95)00110-6)

Micro-electronic displays

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

micro-electronics manufacture

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

micro-machining process

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

micro-manufactured

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

micro-mechanical parametrisations

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K., Wang, Junye, Cross, Mark, Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Bridle, Ian and Leaper, Mark C. (2002) Mathematical modelling of the behaviour of granular material in a computational fluid dynamics framework using micro-mechanical models. In: 5th World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

micro-mechanical parametrizations

Chapelle, P., Christakis, N., Wang, J., Strusevich, N., Patel, M.K., Cross, M., Abou-Chakra, H., Baxter, J. and Tuzun, U. (2005) Application of simulation technologies in the analysis of granular material behaviour during transport and storage. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 219 (1). pp. 43-52. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440805X7044)

micro-particle imaging velocimetry (micro-PIV)

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

micro-physical parametrizations

Christakis, Nicholas, Patel, Mayur and Cross, Mark (2001) Predictions of Segregation of Granular Material with the Aid of PHYSICA, a 3-D Unstructured Finite-Volume Modelling Framework. In: ICFD Conference on Numerical Methods for Fluid Dynamics, 26-29 March 2001, Oxford, UK.

Christakis, Nicholas, Patel, Mayur K., Cross, Mark, Baxter, John, Abou-Chakra, Hadi and Tuzun, Ugur (2002) Predictions of segregation of granular material with the aid of PHYSICA, a 3-D unstructured finite-volume modelling framework. In: International Journal for Numerical Methods in Fluids. Special Issue: ICFD Conference on Numerical Methods for Fluid Dynamics. John Wiley & Sons, Ltd., pp. 281-291. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.319)

micro-probe

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

microassembling

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

microassembly

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

microchannel biochip separator

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

microchannel systems

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

microchannels

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

microelectronic processing

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

microelectronics

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

microelectronics manufacturing

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

microfabricated solenoid inductor

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

microfeeder

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

microfluidics

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

microinductor

Flynn, David, Lu, Hua, Bailey, Chris and Desmulliez, Marc P.Y. (2008) Design, modeling and characterization of a microinductor for future DC-DC power converters. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 577-582. ISBN 978-1-4244-2814-4 (print), 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684414)

microinductors

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

micromagnetic simulation

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Micromagnetic simulation of domain walls in iron films. Journal of Magnetism and Magnetic Materials, 155 (1-3). pp. 49-51. ISSN 0304-8853 (doi:10.1016/0304-8853(95)00665-6)

micromagnetism

Lu, Hua, Bishop, J.E.L. and Tucker, J.W. (1996) Simulation of transverse and longitudinal magnetic ripple structures induced by surface anisotropy. Journal of Magnetism and Magnetic Materials, 163 (3). pp. 285-291. ISSN 0304-8853 (doi:10.1016/S0304-8853(96)00345-9)

micromechanical parametrisations

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur K. and Cross, Mark (2006) On the continuum modelling of segregation of granular mixtures during hopper emptying in core flow mode. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. TU Delft, The Netherlands, The Netherlands. ISBN 9090209700

microsystem design

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

microsystems

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Xue, Xiangdong, Bailey, Chris, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

microvia fabrication

Strusevich, Nadia, Bailey, Chris, Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:10.1109/EuroSimE.2013.6529989)

microvias

Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

microwave

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

microwave cooking

Dinčov, Duško D., Parrott, Kevin A. and Pericleous, Koulis A. (2002) Coupled 3-D finite difference time domain and finite volume methods for solving microwave heating in porous media. In: Sloot, Peter A., Hoekstra, Alfons G., Tan, C.J. Kenneth and Dongarra, Jack J., (eds.) Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, I (2329). Springer-Verlag, Berlin, Heidelberg, Germany, pp. 813-822. ISBN 9783540435914 (doi:10.1007/3-540-46043-8_82)

microwave cure

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

microwave curing

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

microwave heating

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) Heat and mass transfer in two-phase porous materials under intensive microwave heating. Journal of Food Engineering, 65 (2). pp. 403-412. ISSN 0260-8774 (doi:10.1016/j.jfoodeng.2004.02.011)

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

microwave processing

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

microwave radiation

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

microwave system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

microwave systems

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

microwave thawing of frozen food

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

microwaves

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) A new computational approach to microwave heating of two-phase porous materials. International Journal of Numerical Methods for Heat & Fluid Flow, 14 (6). pp. 783-802. ISSN 0961-5539 (doi:10.1108/09615530410544319)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

Miner's linear damage accumulation

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

model implementation

Wheeler, D., Bailey, C. and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:10.1243/0954405981515563)

model-driven prognostics

Rosunally, Yasmine Zaina (2012) Diagnostic and prognostic analysis tools for monitoring degradation in aged structures. PhD thesis, University of Greenwich.

modeling

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

Lu, Hua and Bailey, Chris (2003) Modelling the performance of lead-Free solder interconnects for copper bumped flip-chip devices. In: ASME 2003 International Electronic Packaging Technical Conference and Exhibition. American Society of Mechanical Engineers, New York, USA, pp. 605-610. ISBN 0-7918-3690-8 (doi:10.1115/IPACK2003-35356)

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:10.1109/ESIME.2005.1502852)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

modeling iron

Cross, M., Croft, T. N., McBride, D., Slone, A. K., Williams, A. J., Bailey, C. and Pericleous, K. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. AIST Transactions - Iron and Steel Technology, 3 (7). pp. 155-163. ISSN 1547-0423

modelling

Bailey, Christopher, Lu, Hua, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:10.1108/03056120210696658)

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

Frost, Ian, Patel, Mayur, Galea, Edwin R., Rymacrzyk, P. and Mawhinney, Robert (2001) A semi-automated approach to CAD input into field based fire modelling tools. In: Conference Proceedings: Interflam 2001: 9th International Fire Science and Engineering Conference. Interscience Communications Ltd., Greenwich, London, UK, pp. 1421-1426. ISBN 1899991832

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Rafii-Tabar, Hashem, Lu, Hua and Cross, Mark (1998) A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plate. Journal of Physics: Condensed Matter, 10 (11). pp. 2375-2387. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/10/11/003)

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2004) Modelling the wave soldering process. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 553-558. ISBN 983251486X

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Wheeler, D. and Bailey, C. (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

modelling polymerisation

Glinski, G.P. and Bailey, C. (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

modelling biofluids

Xue, Xiangdong, Patel, Mayur K., Bailey, Chris, Kersaudy-Kerhoas, Maïwenn and Desmulliez, Marc P.Y. (2008) Challenges in modelling biofluids in microchannels. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 287-292. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684363)

modelling methodology

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

Stoyanov, Stoyan, Bailey, Chris, Alam, M.O., Yin, Chunyan, Best, Chris, Tollafield, Peter, Crawford, Rob, Parker, Mike and Scott, Jim (2013) Modelling methodology for thermal analysis of hot solder dip process. Microelectronics Reliability, 53 (8). pp. 1055-1067. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.02.018)

modelling of rail accident

Xue, X., Schmid, F. and Smith, R.A. (2004) A study of modelling approaches for rail vehicle collision behaviour. International Journal of Crashworthiness, 9 (5). pp. 515-525. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2004.0307)

modelling technologies

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

modified EDM

Wang, Zhaozhi, Jia, Fuchen, Galea, Edwin R. and Patel, Mayur (2007) Predicting toxic species concentrations in a full-scale vitiated fire. Interflam 2007 11th International Fire Science and Engineering Conference. Interflam, 2 . Interscience Communications Ltd, London, pp. 1047-1058. ISBN 9780954121693

modules

Warner, Matt, Parry, John, Bailey, Chris and Lu, Hua (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

moisture

Yin, Chunyan, Lu, Hua, Bailey, Chris and Chan, Yan-Cheong (2005) Moisture effects on the reliability of ACF interconnections. Electronics World, 111 (1836). pp. 20-24. ISSN 1365-4675

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

moisture absorption

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

molecular dynamics

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

momentum

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2007) Numerical simulation of incompressible flow problems using an unstructured staggered mesh method. Journal of Algorithms and Computational Technology, 1 (3). pp. 273-302. ISSN 1748-3018 (doi:10.1260/174830107782424066)

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

Monte Carlo calculations

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Monte Carlo study

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

moving meshes

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

MPI

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

multi-physics

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

Cross, Mark, Stoyanov, Stoyan, Mouchmov, Apostol, Lu, Hua, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris and Pericleous, Koulis (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

Slone, Avril Kay (2000) A finite volume unstructured mesh approach to dynamic fluid structure interaction between fluids and linear elastic solids. PhD thesis, University of Greenwich.

Multi-physics modeling

Stoyanov, S. and Bailey, C. (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

multi-physics modelling

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Cross, M., Lyster, C, Bailey, C., Croft, N., Ewer, J., Leggett, P., McManus, K., Pericleous, K.A. and Patel, M.K. (1996) PHYSICA - A software environment for the modelling of multi-physics phenomena. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 105-108. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

multi-physics processes

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C., Bailey, C. and Pericleous, K.A. (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

multi-scale

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

multi-scale computational simulations

Glinski, G.P., Bailey, C., Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

multi-scale simulations

Cross, Mark, Stoyanov, Stoyan, Mouchmov, Apostol, Lu, Hua, Croft, Nick, Slone, Avril, Williams, Alison, Bailey, Chris and Pericleous, Koulis (2003) Multi-physics-multi-scale simulation and optimisation: the next generation. In: NAFEMS World Congress, 2003, Orlando, Florida, USA.

multigrid

Clarke, Nigel and Parrott, Kevin (1999) Multigrid for American option pricing with stochastic volatility. Applied Mathematical Finance, 6 (3). pp. 177-195. ISSN 1350-486X (Print), 1466-4313 (Online) (doi:10.1080/135048699334528)

multiphysics

Cross, Mark, Bailey, Christopher, Pericleous, Koulis, Williams, Alison, Bojarevics, Valdis, Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Xue, Xiangdong, Bailey, Chris, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

multiphysics analysis

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

multiphysics modeling

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

multiphysics modelling

Bailey, C., Taylor, G.A., Cross, M. and Chow, P. (1999) Discretisation procedures for multi-physics phenomena. Journal of Computational and Applied Mathematics, 103 (1). pp. 3-17. ISSN 0377-0427 (doi:10.1016/S0377-0427(98)00236-2)

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

N-body

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

N-body potential

Lu, Hua, Rafii-Tabar, H. and Cross, M. (1997) Molecular dynamics simulation of fractures using an N-body potential. Philosophical Magazine Letters, 75 (5). pp. 237-244. ISSN 0950-0839 (Print), 1362-3036 (Online) (doi:10.1080/095008397179480)

Nano-Imprint Forming (NIF)

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

nano-techology

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

nanopatterning

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:10.1039/c3ra40188j)

natural convection

Dhinsa, K., Bailey, C. and Pericleous, K. (2003) Accuracy of turbulence models and CFD for thermal characterisation of electronic systems. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 507-512. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271573)

neural networks

Zhao, Jun, Patel, Mayur and Knight, Brian (1996) A self-organising neural network for optimal grid distribution. CMS Paper S, 9 (6). CMS Press, London. ISBN 1899991115 (doi:978-1899991112)

neutron quasi-elastic scattering

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (2000) Neutron quasi-elastic scattering in disordered solids: a Monte Carlo study of metal-hydrogen systems. Journal of Physics: Condensed Matter, 12 (11). pp. 2379-2391. ISSN 0953-8984 (Print), 1361-648X (Online) (doi:10.1088/0953-8984/12/11/304)

newmark algorithm

Slone, A.K., Cross, M., Pericleous, K.A. and Bailey, C. (2001) A finite volume unstructured mesh approach to dynamic fluid-structure interaction: an assessment of the challenge of flutter analysis. In: Trends in Computational Structural Mechanics. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain, pp. 741-750. ISBN 8489925771

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Dynamic fluid-structure interaction using finite volume unstructured mesh procedures. In: European Conference on Computational Fluid Dynamics ECCOMAS CFD 2006 Proceedings. ECCOMAS. ISBN 0905091124

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers and Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2003) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Newton Raphson

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

nitrogen

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

no-flow underfill materials

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

non-articulated trains

Roberts, John, Robinson, Mark and Xue, Xiangdong (2008) Comparison of crash dynamics of articulated and non-articulated trains. Passive Safety of Rail Vehicles 2008: Innovation in Passive Safety and Interior Design - 7th International Symposium Passive Safety of Rail Vehicles. Bahntechnik Aktuell (17). IFV Bahntechnik e.V., Berlin, Germany. ISBN 978-3-940727-08-4

non-linear

Slone, Avril, Fallah, Nosrat, Bailey, Christopher and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

non-linear transient finite element simulations

Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

non-Newtonian

Glinski, G.P., Bailey, C. and Pericleous, K.A. (2001) A non-Newtonian computational fluid dynamics study of the stencil printing process. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 215 (4). pp. 437-446. ISSN 0954-4062 (Print), 2041-2983 (Online) (doi:10.1243/0954406011520869)

nonlinear volatility 1. INTRODUCTION

Lai, C.-H., Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:10.1016/j.camwa.2004.03.014)

nuclear magnetic relaxation

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

nucleation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:10.1063/1.1628387)

numerical analysis

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

numerical modeling

Strusevich, N., Bailey, C. and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

numerical modelling

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Chow, P., Bailey, C., Cross, M. and Pericleous, K.A. (1996) The numerical modelling of multi-physics phenomena: The shape casting process. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (S4). pp. 101-104. ISSN 0044-2267 (Print), 1521-4001 (Online) (doi:10.1002/zamm.19960761408)

Djambazov, George Stefanov, Bailey, Chris, Patel, Mayur K. and Shrimpton, Jennifer (2004) Numerical simulation of vacuum dezincing of lead alloy. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2001) Details of an integrated approach to three-dimensional dynamic fluid structure interaction. In: Fluid Structure Interaction. WIT Press, Southampton, UK, pp. 57-66. ISBN 1853128813 ISSN 1353-808x

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

Wheeler, D., Bailey, C. and Cross, M. (2000) Numerical modelling and validation of Marangoni and surface tension phenomena using the finite volume method. International Journal for Numerical Methods in Fluids, 32 (8). pp. 1021-1047. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/(SICI)1097-0363(20000430)32:8<1021::AID-FLD998>3.0.CO;2-1)

numerical models

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

Woon, Fei Ling, Knight, Brian, Petridis, Miltos, Chapelle, Pierre and Patel, Mayur (2004) Enhancing the usability of numerical models with case-based reasoning. Journal of Expert Update, 7 (2). pp. 17-20. ISSN 1465-4091

Numerical Optimilation

Stoyanov, S. and Bailey, C. (2002) Response Surface Modeling and Optimisation for Reliable Electronic Products. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 49-57. ISBN 0780398238

numerical optimisation

Alessandri, E., Buchlin, J.M. and Patel, Mayur (1996) Numerical optimisation of water curtain barriers design. Technical Report. University of Greenwich, London. (doi:1899991166)

Bailey, C., Stoyanov, S., Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

numerical optimization material properties

Stoyanov, S., Bailey, C. and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

numerical schemes

Shala, Mehmet, Patel, Mayur and Pericleous, Koulis A. (2006) Unstructured staggered mesh methods for fluid flow, heat transfer and phase change. WSEAS Transactions on Fluid Mechanics, 1 (5). pp. 431-438. ISSN 1790-5087

Shala, Mehmet, Pericleous, Koulis A. and Patel, Mayur (2006) A two dimensional unstructured staggered mesh method with special treatment of tangential velocity. In: 4th WSEAS International Conference on Fluid Mechanics and Aerodynamics, August 21-23, 2006, Elounda, Greece.

numerical simulation

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

Tilford, Tim, Baginski, E., Kelder, J., Pericleous, Koulis A. and Parrott, Kevin (2006) Microwave modeling and validation in food applications. Annual microwave heating symposium (40th). pp. 208-212. ISSN 1070-0129

numerical simulations

Chapelle, Pierre, Christakis, Nicholas, Abou-Chakra, Hadi, Bridle, Ian, Bradley, M.S.A., Patel, Mayur and Cross, Mark (2004) Computational model for prediction of particle degradation during dilute-phase pneumatic conveying: modeling of dilute-phase pneumatic conveying. Advanced Powder Technology, 15 (1). pp. 31-49. ISSN 0921-8831 (Print), 1568-5527 (Online) (doi:10.1163/15685520460740052)

Tilford, Tim, Baginski, Ed, Kelder, Jasper, Parrott, Kevin and Pericleous, Koulis A. (2007) Microwave modelling and validation in food thawing applications. Journal of Microwave Power & Electromagnetic Energy, 41 (4). pp. 30-45. ISSN 0832-7823

Nusselt number

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

NXP

Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)

off-chip interconnection

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

office-based PCs

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

Oldroyd-B

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

on-chip interconnection

Alam, M. O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

one turn inductor

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

open architecture

Taylor, S., Galea, E.R., Ewer, J., Patel, M.K., Petridis, M. and Knight, B. (1998) SMARTFIRE: an intelligent CFD-based fire model. CMS Press, Greenwich, London, UK. ISBN 1899991301

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

open-ended microwave oven

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

open-ended waveguide cavity oven

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

open-oven

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

OPISA

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optical backplanes optical planar waveguides

Gwyer, D., Misselbrook, P., Bailey, C., Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

optical couplers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271597)

optical fiber

Powell, Adam, Warren, James and Bailey, Christopher (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

optical performance

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

optical waveguides photodiodes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C., Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optimisation

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

optimization

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Stoyanov, S., Bailey, C. and Cross, M. (2002) Optimisation modelling for flip-chip solder joint reliability. Soldering and Surface Mount Technology, 14 (1). pp. 49-58. ISSN 0954-0911 (doi:10.1108/09540910210416477)

optimization of solder

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

optimization tools

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

option pricing

Lai, C.-H., Parrott, A.K., Rout, S. and Honnor, M.E. (2005) A distributed algorithm for European options with nonlinear volatility. Computers & Mathematics with Applications, 49 (5-6). pp. 885-894. ISSN 0898-1221 (doi:10.1016/j.camwa.2004.03.014)

opto-electronic assembly

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

optoelectronic packages

Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

optoelectronic packaging

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

organic light emitting diodes

Stoyanov, S., Kay, R., Bailey, C., Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

organic light emitting diodes (OLED)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

oscillatory flow behaviour

Kerrison, L., Galea, E.R. and Patel, M.K. (1998) A two-dimensional numerical investigation of the oscillatory flow behaviour in rectangular fire compartments with a single horizontal ceiling vent. Fire Safety Journal, 30 (4). pp. 357-382. ISSN 0379-7112 (doi:10.1016/S0379-7112(97)00042-8)

oxygen

Stoyanov, S., Bailey, C., Saxena, N. and Adams, S. (2005) Optimising the wave soldering process for lead free solders. In: Proceeding of 2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability - (2005 AGEC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 125-128. ISBN 0780388062 (doi:10.1109/AGEC.2005.1452331)

Pacala–Hassell model

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

package design parameters

Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

packaged modules

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

packaging

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

packaging design

Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

packaging technology

Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

parallel

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

parallel algorithms

Janssen, R., Dracopoulos, M., Parrott, K., Slessor, E., Alotto, P., Molfino, P., Nervi, M. and Simkin, J. (1998) Parallelisation of electromagnetic simulation codes. IEEE Transactions on Magnetics, 34 (5). pp. 3423-3426. ISSN 0018-9464 (doi:10.1109/20.717806)

parallel architectures

Dracopoulos, M., Parrott, K., Molinari, G., Nervi, M. and Simkin, J. (1997) Results of parallelisation of existing electromagnetic finite codes on some different parallel architectures. Applied Computational Electromagnetics Society Journal, 12 (2). pp. 107-112. ISSN 1054-4887

parallel computer systems

Cross, M., McManus, K., Johnson, S.P., Ierotheou, C.S., Walshaw, C., Bailey, C. and Pericleous, K.A. (1999) Computational modelling of multi-physics processes on high performance parallel computer systems. In: Allan, R.J., Guest, M.F., Simpson, A.D., Henty, D.S. and Nicole, D.A., (eds.) High-Performance Computing. Springer US, pp. 91-102. ISBN 978-0-306-46034-0 (doi:10.1007/978-1-4615-4873-7_10)

parallel computing

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

parallel processing

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

Parallel processing systems

Dracopoulos, Mike C., Glasgow, Craig, Parrott, A. Kevin, Janssen, Rick, Alotto, Pergiorgio and Simkin, John (1997) Bulk synchronous parallelization of industrial electromagentic software. International Journal of High Performance Computing Applications, 11 (4). pp. 344-358. ISSN 1078-3482 (Print), 1741-2846 (Online) (doi:10.1177/109434209701100408)

parallel processing techniques

Grandison, A.J., Galea, E.R., Patel, M.K. and Ewer, J. (2004) The development of parallel implementation for a CFD based fire field model utilising conventional office based PCs. Journal of Applied Fire Science, 12 (2). pp. 137-157. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/AGH5-EXUR-J110-HPHE)

parameterisation

Baxter, John, Gröger, Torsten, Abou-Chakra, Hadi, Tüzün, Ugur, Christakis, Nicholas, Patel, Mayur K. and Cross, Mark (2002) Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method. In: Fifth World Congress on Computational Mechanics (WCCM V), 7-12 Jul 2002, Vienna, Austria.

particle concentration

Deng, T., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of particle concentration on erosion rate of mild steel bends in a pneumatic conveyor. Wear, 258 (1-4). pp. 480-487. ISSN 0043-1648 (doi:10.1016/j.wear.2004.08.001)

particle degradation

Chapelle, P., Christakis, N., Abou-Chakra, H., Tuzun, U., Bridle, I., Bradley, M.S.A., Patel, M.K. and Cross, M. (2003) Computational modelling of particle degradation in dilute phase pneumatic conveyors. In: Kumar, Vipin, Gavrilova, Marina L., Tan, Chih Jeng Kenneth and L’Ecuyer, Pierre, (eds.) Computational Science and Its Applications - ICCSA 2003. International Conference Montreal, Canada, May 18–21, 2003 Proceedings. Lecture Notes in Computer Science, Part I (2667). Springer, Berlin Heidelberg, pp. 493-502. ISBN 9783540401551 (doi:10.1007/3-540-44839-X_53)

particle swarm optimisation algorithm

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

patch dynamics

Perry, Joe N., Noh, Maeng Seok, Lee, Youngjo, Alston, Robert D., Norowi, H. Mohd., Powell, Wilf and Rennolls, Keith (2000) Fitting host-parasitoid models with CV² > 1 using hierarchical generalized linear models. Proceedings of The Royal Society B: Biological Sciences, 267 (1457). pp. 2043-2048. ISSN 1471-2954 (doi:10.1098/rspb.2000.1247)

Pb-free solder

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

PC

Grandison, Angus, Galea, Edwin R., Patel, Mayur and Ewer, John (2007) Parallel CFD fire modelling on office PCs with dynamic load balancing. International Journal for Numerical Methods in Fluids, 55 (1). pp. 29-39. ISSN 0271-2091 (doi:10.1002/fld.1278)

performance

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

PHM

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

photonics

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

PHYSICA

Christakis, N., Patel, M.K., Cross, M., Baxter, J., Abou-Chakra, H. and Tüzün, U. (2001) Continuum modelling of granular flows using PHYSICA, a 3-D unstructured, finite-volume code. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 129-138. ISBN 0873395131

Kiani, Nageena, Patel, Mayur and Lai, Choi-Hong (2007) CFD analysis of one-dimensional infiltration in vadose zone. Journal of Algorithms & Computational Technology, 1 (4). pp. 477-493. ISSN 1748-3018 (doi:10.1260/174830107783133897)

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

physics of failure (PoF)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

physics of failure techniques

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

physics-of-failure

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Physics-of-failure (PoF) model

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

pipe flow

Yao, Jun, Yao, Yufeng, Patel, Mayur and Mason, Peter J. (2007) On Reynolds number and scaling effects in microchannel flows. The European Physical Journal Applied Physics, 37 (2). pp. 229-235. ISSN 1286-0042 (doi:10.1051/epjap:2007010)

plastic deformation

Lu, Hua and Bailey, Christopher (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:10.1109/ITHERM.2002.1012561)

Warner, Matt, Parry, John, Bailey, Chris and Lu, Hua (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

plates

Strusevich, Nadezhda V., Pericleous, Koulis and Hughes, Michael (2002) Characterisation of weldpool shapes in the laser welding of thick plates. In: Mathematical Modelling of Weld Phenomena. Materials Modelling, 6 . Maney Publishing for the Institute of Materials, Minerals and Mining, London, England, UK, pp. 83-92. ISBN 9781902653563

platinum group metals

Benson, M., Bennett, C.R., Harry, J.E., Patel, M.K. and Cross, M. (2000) The recovery mechanism of platinum group metals from catalytic converters in spent automotive exhaust systems. Resources, Conservation and Recycling, 31 (1). pp. 1-7. ISSN 0921-3449 (doi:10.1016/S0921-3449(00)00062-8)

platinum-group metals

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

pneumatic conveyor

Deng, T., Li, J., Chaudhry, A.R., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Comparison between weight loss of bends in a pneumatic conveyor and erosion rate obtained in a centrifugal erosion tester for the same materials. Wear, 258 (1-4). pp. 402-411. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.012)

Deng, T., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors. Wear, 258 (1-4). pp. 426-433. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.010)

pneumatic conveyors

Chapelle, P., Christakis, N., Abou-Chakra, H., Tuzun, U., Bridle, I., Bradley, M.S.A., Patel, M.K. and Cross, M. (2003) Computational modelling of particle degradation in dilute phase pneumatic conveyors. In: Kumar, Vipin, Gavrilova, Marina L., Tan, Chih Jeng Kenneth and L’Ecuyer, Pierre, (eds.) Computational Science and Its Applications - ICCSA 2003. International Conference Montreal, Canada, May 18–21, 2003 Proceedings. Lecture Notes in Computer Science, Part I (2667). Springer, Berlin Heidelberg, pp. 493-502. ISBN 9783540401551 (doi:10.1007/3-540-44839-X_53)

Hanson, R., Allsopp, D., Deng, T., Smith, D., Bradley, M.S.A., Hutchings, I.M. and Patel, M.K. (2002) A model to predict the life of pneumatic conveyor bends. Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 216 (3). pp. 143-149. ISSN 0954-4089 (Print), 2041-3009 (Online) (doi:10.1243/095440802320225284)

pneumatic microactuator

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:10.1051/ijsmdo/2009003)

PoF

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

polymer

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

polymer cure kinetics models

Tilford, T., Ferenets, M., Morris, J.E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, M.P.Y. and Bailey, C. (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

polymer cure models

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

polymer curing

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

polymer encapsulant

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

polymer films

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

polymer materials curing

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

polymeric channels

Li, H., Yu, W., Zhang, L., Liu, Z., Brown, K.E., Abraham, E., Cargill, S., Tonry, C., Patel, M.K., Bailey, C. and Desmulliez, M.P.Y. (2013) Simulation and modelling of sub-30 nm polymeric channels fabricated by electrostatic induced lithography. RSC Advances, 3 (29). pp. 11839-11845. ISSN 2046-2069 (doi:10.1039/c3ra40188j)

polymers

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

porous materials

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) A new computational approach to microwave heating of two-phase porous materials. International Journal of Numerical Methods for Heat & Fluid Flow, 14 (6). pp. 783-802. ISSN 0961-5539 (doi:10.1108/09615530410544319)

porous media

Dinčov, D.D., Parrott, K.A. and Pericleous, K.A. (2004) Heat and mass transfer in two-phase porous materials under intensive microwave heating. Journal of Food Engineering, 65 (2). pp. 403-412. ISSN 0260-8774 (doi:10.1016/j.jfoodeng.2004.02.011)

porous media heat transfer

Dinčov, Duško D., Parrott, Kevin A. and Pericleous, Koulis A. (2002) Coupled 3-D finite difference time domain and finite volume methods for solving microwave heating in porous media. In: Sloot, Peter A., Hoekstra, Alfons G., Tan, C.J. Kenneth and Dongarra, Jack J., (eds.) Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, I (2329). Springer-Verlag, Berlin, Heidelberg, Germany, pp. 813-822. ISBN 9783540435914 (doi:10.1007/3-540-46043-8_82)

portability

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

post-flashover

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

potting cure

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

power bipolar transistors

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Power Electronic Module (PEM)

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

power electronic modules

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

power electronic modules (PEMs)

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

power electronics

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

Newcombe, D. R. and Bailey, C. (2007) Rapid solutions for application specific IGBT module design. International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

power electronics module

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

power electronics modules

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

power electronics modules (PEMs)

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

power integrated circuits

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

power module components

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

power modules

Rajaguru, Pushparajah (2014) Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules. PhD thesis, University of Greenwich.

power supply circuits

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

predictability

Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)

prediction systems

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

predictive reliability

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

printed circuit board reflow

Stoyanov, Stoyan, Dabek, Alexander and Bailey, Chris (2013) Thermo–mechanical sub–modelling of BGA components in PCB reflow. In: Proceedings of 36th International Spring Seminar on Electronics Technology, Alba Iulia, Romania, May 8-12, 2013, pp.1-8. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 253-258. ISBN 9781479900367 ISSN 2161-2528 (doi:10.1109/ISSE.2013.6648252)

printed circuit boards

Bailey, Chris, Wheeler, Daniel and Cross, Mark (1998) Numerical modelling of solder joint formation. Soldering & Surface Mount Technology, 10 (2). pp. 6-13. ISSN 0954-0911 (doi:10.1108/09540919810219912)

Wheeler, D., Bailey, C. and Cross, M. (1998) A computational modelling framework to predict macroscopic phenomena in solder joint formation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 212 (2). pp. 141-157. ISSN 0954-4054 (Print), 2041-2975 (Online) (doi:10.1243/0954405981515563)

printed circuit design

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

printed circuit manufacture

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

printed circuits

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:10.1109/EMAP.2012.6507864)

printing

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. and Bailey, C. (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

probabilities

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

probability based analytical tools

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

process engineering industry

Christakis, Nicholas, Chapelle, Pierre, Patel, Mayur, Cross, Mark, Bridle, Ian, Abou-Chakra, Hadi and Baxter, John (2002) Utilising computational fluid dynamics (CFD) for the modelling of granular material in large-scale engineering processes. In: Computational Science - ICCS 2002: International Conference Amsterdam, The Netherlands, April 21–24, 2002 Proceedings. Lecture Notes in Computer Science, Part 1 (2329). Springer Berlin Heidelberg, Berlin, Heidelberg, Germany, pp. 743-752. ISBN 9783540435914 ISSN 0302-9743 (Print), 1611-3349 (Online) (doi:10.1007/3-540-46043-8_75)

product functionality

Bailey, C. (2003) Exploiting virtual prototyping for reliability assessment. In: Proceedings of International IEEE Conference on the Business of Product Reliability and Liability. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 2-8. ISBN 078039853X

prognostic and health management (PHM)systems

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

prognostics

Sutharssan, Thamo, Bailey, Chris, Stoyanov, Stoyan and Rosunally, Yasmine (2011) Prognostics and reliability assessment of light emitting diode packaging. In: Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4577-1770-3 (print), 978-1-4577-1768-0 (eISBN) (doi:10.1109/ICEPT.2011.6066984)

prognostics and health management (PHM)

Sutharssan, Thamotharampillai (2012) Prognostics and health management of light emitting diodes. PhD thesis, University of Greenwich.

prognostics framework

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Chris, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2009) Development of a prognostics framework for the iron structural material of the s.v. Cutty Sark. In: Proceedings of Sixth International Conference on Condition Monitoring and Machinery Failure Prevention Technologies – CM/MFPT 2009. The British Institute of Non-Destructive Testing / Coxmoor Publishing, Northampton, UK, pp. 674-685.

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

prognostics health management

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

prognostics prediction methodology

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/1 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

prototyping

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

puncture point

Deng, T., Patel, M., Hutchings, I. and Bradley, M.S.A. (2004) Effect of bend orientation on life and puncture point location due to solid particle erosion of a high concentration flow in pneumatic conveyors. Wear, 258 (1-4). pp. 426-433. ISSN 0043-1648 (doi:10.1016/j.wear.2004.02.010)

pyrolysis

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of noncharring thermal degradation and its application to the prediction of compartment fire development. In: Fire Safety Science: Proceedings of the Sixth International Symposium. IAFSS Symposiums (6). International Association for Fire Safety Science, Greenwich, London, UK, pp. 953-964. ISBN 0925223255 (doi:10.3801/IAFSS.FSS.6-953)

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of the noncharring pyrolysis process and fire development within a compartment. Applied Mathematical Modelling, 23 (8). pp. 587-607. ISSN 0307-904X (doi:10.1016/S0307-904X(99)00003-7)

Jia, F., Galea, E.R. and Patel, M.K. (1997) The prediction of fire propagation in enclosure fires. In: Fire Safety Science: Proceedings of the fifth international symposium. International Association for Fire Safety Science, Greenwich, London, pp. 439-450. ISBN 4990062555 ISSN 1817-4299 (doi:10.3801/IAFSS.FSS.5-439)

Jia, Fuchen, Galea, Edwin and Patel, Mayur (1998) The numerical simulation of enclosure fires using a Cfd fire field model coupled with a pyrolysis based solid fuel combustion submodel—a first approximation. Journal of Fire Protection Engineering, 9 (4). pp. 1-17. ISSN 1042-3915 (Print), 1532-172X (Online) (doi:10.1177/104239159800900402)

pyrolysis model

Jia, F., Galea, E.R. and Patel, M.K. (1999) Numerical simulation of the mass loss process in pyrolizing char materials. Fire and Materials, 23 (2). pp. 71-78. ISSN 0308-0501 (Print), 1099-1018 (Online) (doi:10.1002/(SICI)1099-1018(199903/04)23:2<71::AID-FAM672>3.0.CO;2-5)

pyrolysis modelling

Jia, F., Galea, E.R, and Patel, M.K. (2000) The numerical simulation of compartment fires using an integrated gas and solid phase combustion model. In: ACME '2000 The 8th Annual Conference of the Association for Computational Mechanics in Engineering. Extended Abstracts. University of Greenwich, Greenwich, London, UK, pp. 50-53. ISBN 1861661509

Jia, F., Galea, E.R. and Patel, M.K. (1999) The numerical simulation of fire spread within a compartment using an integrated gas and solid phase combustion model. Journal of Applied Fire Science, 8 (4). pp. 327-352. ISSN 1044-4300 (Print), 1541-4183 (Online) (doi:10.2190/UY41-W38Q-X6KK-TXYV)

pyrometallurgical process

Benson, M., Bennett, C.R., Patel, M.K., Harry, J.E. and Cross, M. (2000) Collector-metal behaviour in the recovery of platinum-group metals from catalytic converters. Transactions of the Institute of Mining and Metallurgy, Section C: Mineral Processing and Extractive Metallurgy, 109 (1). pp. 6-10. ISSN 0371-9553 (Print), 1743-2855 (Online) (doi:10.1179/mpm.2000.109.1.6)

Quad Flat Package

Stoyanov, Stoyan, Best, Chris, Yin, Chunyan, Alam, M.O., Bailey, Chris and Tollafield, Peter (2012) Experimental and modelling study on the effects of refinishing lead-free microelectronic components. In: 2012 4th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781467346450 (doi:10.1109/ESTC.2012.6542213)

quality control

Parry, John, Bailey, Chris and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

radiative fluxes

Robinson, J.E., Hull, T.R., Lebek, K., Stec, A.A., Galea, Edwin R., Mahalingam, Arun, Jia, Fuchen, Patel, Mayur and Persson, H. (2007) Assessment of the impact of computed and measured fire environments on building evacuation using bench and real scale test data. Interflam 2007 11th International Fire Science and Engineering Conference. Interscience Communications, Greenwich, pp. 873-884. ISBN 9780954121693

radio frequency (RF) curing

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

rail cab collapse

Xue, X., Schmid, F. and Smith, R.A. (2004) A study of modelling approaches for rail vehicle collision behaviour. International Journal of Crashworthiness, 9 (5). pp. 515-525. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2004.0307)

Xue, X., Smith, R. and Schmid, F. (2005) Analysis of crush behaviours of a rail cab car and structural modifications for improved crashworthiness. International Journal of Crashworthiness, 10 (2). pp. 125-136. ISSN 1358-8265 (Print), 1754-2111 (Online) (doi:10.1533/ijcr.2005.0332)

rail safety