Items where Author is "Wu, B.Y."
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63Sn37Pb solder joints
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)
and alloys
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
and failure
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
Au/Ni metallization
Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)
ball grid array (BGA)
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)
ball shear test
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
bond strength
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
brittleness
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
corrosion fatigue
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
cracking
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
Cu trace
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)
current crowding
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
current stressing
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)
electromigration
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
electron bombardment
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
embrittlement
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
failure mechanisms
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
fatigue
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
Finite Element Analysis(FEA)
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
fracture
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
fracture propogation path
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
high current density induced damage
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
interfacial reaction
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)
interfacial reaction phenomena
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
intermetallic compound (IMC)
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
mathematical modelling
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
metals
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
off-chip interconnection
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
on-chip interconnection
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
semimetals
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)
solder interface strength
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
solder joints
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)
thermomigration
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)