Items where Author is "Tilford, T."
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computer control systems
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
conversion efficiency
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
coupled solution
Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
cure data
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
cure kinetics
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
cure kinetics models
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
cure process
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
curing
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
curing encapsulant materials
Adamietz, R., Tilford, T., Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
curing of an encapsulant material
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
curing process
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)
design
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
differential scanning calorimetry (DSC)
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
differential scanning calorimetry
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
Differential Scanning Calorimetry (DSC)
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
dual-section microwave system
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
electromagnetic heating
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
electronic packaging
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
electronics packaging
Adamietz, R., Tilford, T., Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
encapsulant
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
encapsulant curing
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)
encapsulant material
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)
encapsulants
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
estimate of cure
Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)
Fourier transform infra-red spectroscopy (FTIR)
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
heating
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)
isotropic conductive adhesive materials
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
materials
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
microelectronics packaging
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
microwave
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
microwave curing
Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)
microwave curing system
Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)
microwave devices
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
microwave energy
Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)
microwave measurements
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
microwave oven
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)
microwave ovens
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
microwave processing
Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
microwave theory and techniques
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
multiphysics analysis
Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
numerical analysis
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
numerical simulation
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)
open-ended microwave oven
Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)
open-ended waveguide cavity oven
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
ovens
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
packaging
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
particle swarm optimisation method
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
particle swarm optimization
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
polymer crosslinking
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
polymer cure models
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
radio frequency (RF) curing
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
resonant cavity
Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)
resonant microwave applicator
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
stoves
Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)
temperature measurement
Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)
thermal stresses
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
thermomechanical stress development
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)
thermosetting polymer
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
variable frequency microwave (VFM) heating
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)
Variable Frequency Microwave (VFM) system
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)
waveguide resonator
Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)